Materials: fr-4, cem-3, high tg, fr4 halogen-free and rogers
Surface finish/treatment: hasl/lead-free hasl, immersion gold plating, silver, tin or osp
Layers: 1 to 16
Board finished thicknesses: 0.4 to 3.2mm
Minimum hole size: 4 mils (0.1mm)
Minimum trace width/space: 3.5 mils
<25kg/carton
Single-side flexible
Board thickness: 0.1mm
Finish copper: 35um
Surface finish: chemistry ni/au
100% e-test
Ipc-2
340*240*160mm carton
<20kg
2 layers
Flexible
Thickness of board: 0.2mm
Finish copper: 1oz
Min l/w: 4/4mil
Surface finish: chem ni/au
100% e-test
Material: fr4
Setup: 3 + 4 + 3
Finishing thickness: 1.0 ¡¨¤0.1mm
Minimum width/spacing: 0.10/0.10mm
Minimum laser via: 0.1mm
Surface finishing: enig + osp
Specialty: blind and buried via
Application field: communication
<25kg
