Product Material:
Materials maximum effective size: 600mmX1300mm
Material thicknes: 0.05mm~1.2mm
Processing materials:
Stainless steel series , For example SUS301 SUS302 SUS303 SUS304 SUS316 SUS430 Etc.
Copper and copper alloy series: Copper , Brass , Bronze , Copper-nickel alloy , C194 Copper (Lead frame materials used). Aluminum and aluminum alloy series, For example1A991A9510501A50 Etc.
Nickel and nickel alloy series: Pure Nickel , E-nickel alloy , Nickel-manganese alloy
For exampleYEF4264J424J429 Etc.
Product precision
Material thickness/Item 0.05mm~0.10mm, Minimum aperture1.3X Material thickness, The smallest
diameterLess than Material thickness, General Tolerance : 0.015~0.035mm.
Material thickness/Item 0.10mm~0.20mm, Minimum aperture1.2X Material thickness, The smallest
diameterto be equal to Material thickness , General Tolerance : 0.035~0.05mm.
Material thickness/Item 0.20mm~1.2mm, Minimum aperture1.1X Material thickness, The smallest
diameter1.1X Material thickness , General Tolerance : 0.05~0.10mm.
We offer our customers a wide range of photo etched plate, which are available following specifications:
Technical standard
Minimum wire diameter to be machined:0.02mm max.Batch to be machined :500mmx600mmthickness of material to be machined:0.02mmto 0.5mmprecision of delineation at machined:0.01mmuse covering:etching is widely used in all integrated circuit lead frame and other fields, e.G.Fluorescent display screen, guard net, precise filter, encoder raster, micro-electrode, mask plate, integrated circuit cover, kinsecope shade mask, smt, tin-paste net press plate.
