Special futures
Thickness: 1.6mm
Application: projector or projecting apparatus
Minimum trace size: 0.1mm
Minimum drill: 0.15mm
With blind and buried holes
Layers: 1 to 28
Board finished thicknesses: 0.2 to 7.0mm
Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B
Maximum finished board size: 580 x 900mm
Minimum hole size: 4mil (0.1mm)
Minimum trace width/space: 3.5/3.5mil
Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP
Copper thicknesses: 0.5 to 6oz
Solder mask colors: green, yellow, black, white, red and blue
Copper thickness in hole: >18um
Inner packaging: plastic bag (vacuum packing)
Outline tolerance: ¡À0.13mm
Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm
With UL and TS16949:2002 marks
Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
Profiling: punching, routing, V-cut and beveling
OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided.
Inner:vacuum packaging.
Outer:carton.
