It is mainly used for high temperature firing of thick film circuit, precision resistance, chip electronic components, LTCC, glass glaze, ceramic filter and annealing of photovoltaic thin film glass.
Rated temperature:RT-850
Heating elements:Heating board
Quantity of heating zone: 7 zones
Temperature uniformity:
Belt width:350mm
Belt material:Cr20Ni80
Cooling mode:Fan cooling
This furnace is designed for thick film products firing, such as Hybrid IC, chip-R, SMD components terminal, LTCC, Stainless steel heater, PV thin film cell and other similar products.
Temperature Range:
Belt Material: Cr20Ni80
Firing Atmosphere: Dry and clean Compressed air.
Heating Element heating board
Cooling Mode: fan cooling.
Temperature Zone: 6 Zones.
Chamber Temperature Uniformity:
Overall Dimension:
