Semiconductor laser.
Dimensions: 6.5x12 mmWavelength: 650 nm Output Power: < 1 mw Beam Size: 90% (Voltage: 2.7 í½ 5.5 VDC )íííííííííííííí > 85% (Temp.: ú¡10ípC í½ 50ípC) Operating Voltage: 2.6 í½ 5.5 VDC Operating Current: < 28 mA Operating Temp.: - 10ípC í½ 50ípC torage Temp.: ú¡40ípC í½ 80ípC Optical Lens: Plastical CDRH Class: Class II.
Laser Diode Collimators is used in many scientific research field and some industrial production. Laser is better collimation power. Semiconductor Laser Diode Collimators is better than laser modulation with its small dimensions, high collimation (Divergence < 0.1mrad). Our company's design and product for Laser Diode Collimators is specially served for various scientific research and industrial production.
Laser marking device.
Powellenses is one kind of opticaruling lens, xi'an lingyue machinery&electr.Ltd.Cnsupply powellenses that divergence angle from 10íp to 100íp, the standard have 30íp\45íp\53íp\60íp\70íp\85íp\90íp. When 1mm laser bean get through the powellenses, it is optimized transformed a line which is uniform, stability, straight .Lineation by powellenses is better than aspheric lensse, as by powellense can cancelling centrahotspot of gaussian beams and fade-marginadistribution. Applied range: Laser scriber Machining -position by makeing Building- graticule by makeing Laser scanning system Customs can order by index following Divergence angle Work distance Beam wavelength or beam diameter Width of lineation. Standard: Divergence angle materials 30íp bk7 45íp sf6 53íp bk7 60íp sf6 70íp sf6 85íp sf6 90íp sf6.
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
Laser cutting (84561000)
Properties 1. Excellent transparency, outstanding resistance to aging. 2. It has good insulating properties and mechanical strength; to acid, alkali, salt has a strong resistance to corrosion; and because easy processing. Applications 1.Extruded sheets for signage, displays and building material 2.Motive parts such as tail lamps, meter covers and sun visors 3.General sundries such as tableware, kitchenware, giftware and bathroom accessories 4.Optical lenses such as sunglasses, reading glasses and camera lenses 5.Light guide panels for LCD displays 6.Other applications such as mobile phone display panels, clock covers, lighting covers/accessories, optical fibres, toys, etc.
Semiconductor Laser Filter, applied to blue and green semiconductor laser, to cut off the 808nm and 1064nm laser, while to pass the blue and green laser. Substrate---------D263T/B270/BK7 or customized Thickness---------0.3~1.1mm Surface Quality---40/20, 60/40 Square Size------(3~15)×(3~15)mm Round Size-------φ3~20mm (The final detailed specifications are customized or suggested by Lenoptec.) All Optical filters-Coatings include: Acrylic Filters Dichroic Filters Beam Splitters Reflective Coatings Interference Filter Waterproof and dustproof coatings AR coatings UV-IR Blockers IR Cut-off Filters Cartons
