We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Konrich can produce many types of pcb boards - normal single, double to multilayer boards, HDI as well Flex & Rigid-flex boards. Our pcb boards are widely used in many fileds - Industrical control, Communication, Medical, Security, Consumer Electronics, etc.
4-layer PCB Minimum line width/space: 5mils Surface finish: immersion gold Board thickness: 15.75mils Minimum drilled hole diameter: 10mils Copper thickness:1oz 1
PCB - printed circuit board Our company is specialized in doublesided and multi-layer pcb, pcba, oem and so on. Our mission is to be the most successful pcb and pcba maker. We have advanced production machine and stable product quality. Also you can enjoy our considerate after-sales service. You can search our webside to know our company and our product. If you are interested in our product, please have no hesitent to contact with us. We hope youf+re not too busy to know us.
Our Product Range 4-28 layer of high-precision impedance, blind & buried layers, HDI boards, high frequency board, halogen-free boards, high-TG boards, aluminum, copper, iron base and ceramic-based circuit board, 1-6 layer flexible circuit board ( FPC) and rigid-flex flexible board, and other high-tech products. PCB Process Capability processing layers: 1- 30 layers Finished thickness: 0.008 "~ 0.24" (0.20mm ~ 6.0mm) Minimum aperture: 6mil (0.15mm) Minimum line width / spacing: 3-4 mil (0.076-0.10mm) Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm) Impedance Control: ± 10% Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger, immersion Silver, Immersion Tin. Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), High frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE), AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), Ceramic substrate (Ceramic Base)
Number of Layers: 1-14Layer Base Material: FR4 Copper Thickness: 0.5oz-6oz Board Thickness: 0.2mm-7mm Min. Hole Size: 0.2mm Min. Line Width: 0.075mm (3mil) Min. Line Spacing: 0.075mm (3mil) Surface Finishing: Immersion Gold, HASL, OSP, Enig, Gold Fingers, etc Board Size: Multilayer Quality Control: FQC, FQA Services: EMC, ODM, OEM Testing Service: Aoi X-ray Function Test Certificate: UL, TS16949, ISO9001, RoHS, SGS
Name: Communication Module Board Number of layers: 4 layers Material: FR-4 Board thickness: 1.6mm Surface Plating: Immersion Gold Special Process Description : 0.25BGA Special technology explanation: Black Matte Ink, gold thickness 5M Most important key points of OEM 1.FR4, Ceramic, High TG, Rogers, High Frequency RF, Halogen free, Aluminum-based PCB etc. available. 2.This FR4 PCB can be up to 32 layers. 3.ENIG, lead-free HASL, gold flash, OSP, gold finger, Hard & Soft Gold, immersion gold/silver/tin surface finish etc. available 4.Copper thickness is 1 to 6oz on the inner layer and 0.5 to 5oz on the outer layer. Has 3mil minimum line width and spacing, and as small as 0.2mm holes. 5.Board thickness: 0.3~3.5mm 1. 13 years professional PCB/PCBA manufacturing experience. Specializing in electronics manufacturing service including electronic design and engineering, PCB Fabrication & Assembly, SMT, custom printed circuit board products, One-stop cost-effective PCB Solutions, Electronic Components Procurement, prototyping, turnkey solution and other value-added service. 2. Excellent and high process capability, Specialized in 2 to 32 layer PCBs, FR4, Ceramic, High TG, Rogers, High Frequency RF, Halogen free, Aluminum-based PCB etc. available, with 3mil minimum line width and spacing and as small as 0.2mm holes. Copper thickness is 1 to 6oz on the inner layer and 0.5 to 5oz on the outer layer. 3. International quality & environment certifications. GX quick has been certificated by international quality & Environment systems such as ISO9001, ISO14001, SGS, RoHS, UL etc. 4. A large number of advanced equipment imported from the United States, Japan, Germany, Israel . Sophisticated equipment is gradually introduced to ensure excellent manufacturing process capabilities, such as: 1) Drilling machine 2) Full automatic plating line 3)Figure electric automatic line 4) Punching machine 5) Digital control routing machine 6) PTH 7) Antioxidant treatment line 8) Full automatic digital control V-CUT machine 9) Lami-machine 10) AOI testing machine 11) CCD-Exposal room 12) Automatic dry film machine 13) High speed flying probe machine 14) Fully automatic temperature control baking ovens. 15) Dedicated testing machine 5. Free samples with sample costs refunded after confirmed standard order, 24-hour quick-turn service. 6. High quality raw materials from top suppliers for laminates, copper foil, PP and more. Quality goal Total scrap rate â?¦ 1.8% customer satisfactionâ?§90% Template punctuality delivery rate â?§ 98% batch punctuality delivery rate â?§ 92% Customer complaint rate â?¦ 1% customer return rate â?¦ 0.5% Comprehensive Qualified rate â?§ 98% batch board utilization â?§ 90% Pre-launch rate: â?¦ 3% backwash solder mask â?¦ 3%, circuit â?¦ 2.5%
Layer: 1 to 16 layers Material type: FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX Board thickness: 0.20mm to 3.4mm copper thickness: 0.5 OZ to 6 OZ copper thickness in hole: >25.0 um(>1mil) Max size of finish board: 700*460mm Min.Drilled Hole Size: 1.0mm Min.Line Width: 3mil Min.Line Spacing: 3mil Surface finishing: HASL/HASL lead free,HAL,Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating Solder Mask Color: Green/Yellow/Black/White/Red/Blue Shape tolerance: ±4mil Hole tolerance: PTH:±3mil,NPTH:±2mil Package: Inner paking/Plastic bag,Outer packing:Standard carton packing Certificate: UL,SGS, ISO 9001:2008,IATF16949 Special requirements: Buried and blind vias+controlled impedance+BGA Profiling: Punching,Routing, V-CUT,Beveling