PCB Assembly 6-layer PCB FR4 1.6mm 0.2mm pitch component RoHS compliant
Double-sided PCB Layer count: 2 Base material: FR4 Board thickness: 1.6mm Surface finishing: HAL (Hot Air Levelling) RoHS-compliant
Single-sided Flexible PCB Single-sided flexible PCB Base material: polyimide Conductor: copper
Double-sided FPC Base material: polyimide Polyimide stiffeners on 2 places Surface treatment: tin plating Silkscreen: white, single-sided
Double-sided FPC Board dimensions: 380 x 35mm Base material: polyimide Surface treatment: immersion gold FR4 and PET stiffeners
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
• Place of Origin: Guangdong, China (Mainland) • Brand Name: ShanXu • Model Number: PCB RoHS Compliant • Number of Layers: 1-30 layer • Base Material: FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium • Copper Thickness: 1/3oz ~ 6oz • Board Thickness: 0.2mm ~ 7.0mm • Min. Line Width/space: 3mil/3mil • Min. Hole Size: 0.2MM • Surface Finishing: Immersion Gold/Au, HASL,LF HASL, OSP, Immersion silver, etc. • Impedance control: ±10% • Solder mask:green/black/white/red/blue/yellow,etc • Silkscreen: White, Black, Yellow, Blue • Hole tolerance: PTH:±0.075,NTPH:±0.05 • PCB Standard: IPC-A-610 E Class II-III • profiling punching: Routing, V-CUT, Beveling • Wrap and twist: 5%
We have over 10years experiences in fpc manufacturing, 1 layer to 6 layer fpc manufacturing and smt assembly, including components sourcing with competitive cost. FPC Process Capability processing layers: 1-6 layers Finished thickness: 3mil (0.08mm) Minimum aperture: 4mil (0.10mm) Min.line width / spacing: 2 mil (0.05mm) Maximum board size: 10 "x 45" (250x 1200mm) Surface Treatment: OSP, HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold Insulation resistance: ± 1011(Normal Normal) Thermal shock resistance: 260 10 sec. Processing materials: Polyimide (PI), polyester (PET), polyimide (PI) + FR4