INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:
High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.
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Although the Intel EP80579 branding will be new to most of you, the underlying technology is comprised of products that have a well established history at Intel. In fact, this line of products is based on the Pentium M processor core, as it has been in development for quite some time now. The Intel EP80579 Integrated Processor family, however, is more than just a new processor. The products actually consist of new System on a Chip designs that integrate a Pentium M core, with a Memory Controller Hub (MCH), I/O hub (ICH), and in some cases specialized security, TDM (Time Division Multiplexing for voice-over-IP apps), and data path acceleration engines, which have been dubbed Intel QuickAssist Technology.
Development was started on the Intel EP80579 Integrated Processor family to prepare the company for the impending onslaught of smart, Internet-connected devices and appliances predicted to arrive over the next few years. The Intel EP80579 product line puts Intel in a position to target several growth areas across Consumer Electronics (CE), Mobile Internet Devices (MIDs) and other embedded markets. "We’re now able to deliver more highly integrated products ranging from industrial robotics and in-car infotainment systems to set-top boxes, MIDs and other devices. By designing more complex systems onto smaller chips, Intel will scale the performance, functionality and software compatibility of IA while controlling the overall power, cost and size requirements to better meet respective market needs,” said Gadi Singer.
The individual components within the Intel EP80579 SoCs communicate over an internal Front Side Bus that connects the Processor Core, MCH, and ICH. And Intel has also developed a high performance bus to connect the security, TDM, and data path acceleration engines to the I/O Complex. Please note, that only four of the initial eight products being announced today feature the Acceleration Services Unit and TDM interface represented in the block diagram above. Those features are what make up the Intel QuickAssist Technology, which isn't featured on every Intel EP80579 SoC.
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