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Fudatonghe Limited

Supplier From China
Nov-30-22
Supplier : Electronic Components, Ic Chips, Chips, Components, Diodes, Triodes

Established: 2001

Verification Status



Contact Details:
Saige Building, Huaqiang North Street, Futian Distric, Shenzhen, Guangdong
Shenzhen 525200
Guangdong China


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INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:

High-speed electronics
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We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
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Gaas Wafers, WAFERS

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Gallium Arsenide (GaAs) wafers are critical components in modern electronics and photonics due to their superior electrical and optical properties.

Here�¢??s a focused overview:

GaAs�¢?? is shorthand for Gallium Arsenide, a compound made up of two elements, and the semiconductor used to manufacture GaAs wafers. GaAs is used as a direct bandgap semiconductor, which in layman�¢??s terms, simply means that particles such as electrons can pass through components much quicker and with very little interference. This makes them particularly useful in optical devices because photons, the basic unit for all light, can pass through lenses with ease.

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Product Overview

The ignition point of a fire inside the electric panel is mostly the part where the terminal block is fastened, so in order for initial fire extinguishing, the solution should be closely installed to the part where the terminal block is fastened.
In the case of a small electric panel, a complete initial fire extinguishing is expected for fires occurring inside the electric panel by attaching the SFEX Pad to the top surface of the electric panel.

Product Feature

It has an excellent performance in the initial fire suppression as it can be installed near the ignition point as a flexible rope type.
It uses a stand-alone method based on polymer chemistry so that it does not cause malfunctions and maintenance costs.
The thermo-responsive Granule composed of KNO3 and subsidiary catalysts It does not affect the peripherals after the fire goes out.
Function of SFEX Granule = fire extinguishing agent storage tank + temperature sensor + nozzle function
Fire extinguishing method : Suffocation + subsidiary catalyst


Example of Installation 1 : SFEX Line - If ducts exist

Installing the SFEX Line horizontally or vertically in the ducts closest to the expected ignition points
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Example of Installation 2 : SFEX Line - If ducts do not exist

Installing the SFEX Line horizontally or vertically, close to the expected ignition points of the Electric panel



Example of Installation 2 : SFEX Pad - Small Electric Panel

Simply attach it to the top inside the Electric panel.
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