The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:
High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.
Three heads:
1.1064nm head for black, blue, brown tattoo;
2.532nm head for red, orange, pink and colorful tattoo;
3.1320nm Carbon peeling head optional for Skin rejuvenation, whitening, tighten pores, acne removal etc.
Our organization is offering an astonishing range of Laser Cutting Services. Offered array of services is rendered according to quality norms. In addition to this, offered services are much admired due to their hassle free management, on-time execution, and client-focused approach.
Our Laser Cutting-Bending software are qualified to handle any complicated shape with less process time and high accuracy with zero tooling cost with prompt services in low/high (Bulk) Quantities Supply.
We look forward to business association with you for long term. We offer economical rate in volume business tie up
Choices - Comprehensive selection of air- and water-cooled CO2 lasers with options to suit every need
ò OEM BASIC- Available in air-cooled and water-cooled configurations
ò OEM INTEGRATED - Available in air-cooled configuration with aluminum fan shroud - ideal for "bolt on" integration; no plumbing or chillers necessary
ò Class IV - Available in air-cooled or water-cooled configurations with key switch and shutter safety interlocks
Kink-free operating power up to 600mW;
epoxy-free, and flux-free 14-PIN butterfly package with SM Hi1060 or PM fiber;
Fiber Bragg grating stabilization;
Wavelength selection available;
Integrated thermoelectric cooler, thermistor, and monitor diode.
