We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Hankook Smart Flex AH35 FEATURES AND BENEFITS All weather traction Enhanced controllability Fuel efficient drive Excellent durability The Hankook Smart Flex AH35 is a highway terrain all-season tire manufactured for commercial vehicles. The tyre model is made to be mounted on the vehicle's steering axle. Hankook Smart Flex AH35 - Key Features All-Weather Performance: The tire offers reliable traction in dry, wet, and winter conditions, thanks to its wide grooves and 3D sipes, which also prevent hydroplaning. Enhanced Control: The ribbed tread design ensures constant road contact, improving steering response and driving stability. Fuel Efficiency: The optimized 3D siping reduces rolling resistance, leading to lower fuel consumption and CO2 emissions. Durability: Reinforced carcass structure maintains the tire's shape under heavy loads, extending tread life and making it cost-efficient.
Board thickness: 0.2mm-6.0mm Laminate: fr-4, taconic, rogers, tg170, tg180, cem-1 Layers: single side, double side, multilayer Outer / inner coppers: 1/1 oz, 1/2 oz, 2/2 oz, 2 oz, 3 oz, 4 oz. Multilayer stack up: stack up, controlled impedence. Pcb size: unit size, panel size, tooling strips, tooling holes and fudicials. Min hole size: 0.2mm (shape tolerance¡à 0.13mm, hole tolerance: pth¡à 0.075mm; npth: ¡à 0.05mm) Min line width: 0.1mm Min line spacing: 0.1mm Solder mask color: green, blue, red, black, yellow, white Legend color: white, yellow, black, blue, red Surface finished: hal(tin / lead), hal(lead free), immersion gold, immersion silver, Immersion tin, gold plated(soft gold), osp(entek). Certificate: rohs, sgs, ukas, iso14001, dnv, ul Profiling: cnc, routing, punching, beveling, v-cut, v-score, counter sink. Test: e-test, fixture, fly-test. Special technique: buried and blind vias, controlled impedance, bga. We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Package: vacuum package
Supplier: Micro silica (silica fume), silica, fly ash, pozzolano, ggbfs and white cement, other cementatious materials and factory/plants specialized spare parts & equipments, automation & switchgear, drives & transmission spares, instrumentation & pump, pneumatic & hydraulic spares, valves & actuators, mechanical parts, high carbon ferro chrome, foundry pig iron, iron ore concentrate, chromite ore, antimony ore, silicon metal 441 (powder), ferro silicon (fesi), iron ore pellet, copper concentrate
Thick-Copper PCB With the highly development of telecommunications and electronics industry, thick copper board is widely required by PCB customer. Thick copper PCB is mainly used for central power system and power electronic devices, which is because it enables the board to conduct higher current and decrease the product size. China thick copper board mean the finished copper thickness of the board is more than 4OZ(140um), this is the most important factor for us to compare the thick copper PCB from those standard PCB with 1OZ or 2OZ copper. Copper PCB manufacturing Capabilities Table
Material: fr4 Layers:2 Thickness: 1.6mm Surface finishing: enig Copper thickness: 1 oz Soldermask: green Silkscreen: white
Copper Core PCB with 3 OZ copper thickness: Layers : Single Layer PCB Material: Copper core Board Thickness: 3.0mm Surface Finishing: OSP Finished Copper thickness: 3 OZ Solder mask: White Color Special Technology: Thermal Conductivtiy 3W/mk Copper thickness 3oz PCB board thickness 3.0mm Our Service: Quickturn around PCB prototype manufacturing PCB fabricate and PCB assembly service Stencil service Minimum Circuit Trace Width/Space: 2.7/2.7mil The Minimum Via Size : 0.15mm The Minimum legend Height/Width: 0.5mm/0.12mm Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide Final Board Thickness: 0.4mm ~ 6.0mm Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole Quick-turn Lead Time: 1 Day for 2 Layer PCB, 2 Days for 4 Layer PCB, 3 Days for 6 Layer PCB
2 layer with 10 oz / 350um copper Material: fr4 (tg 135'c) Finished thickness: 1.6mm Finished copper: 10 /10 oz Min hole size: 2.0 mm Without solder mask. Surface: osp