hot air rework desoldering station is a professional phone repair rework station, desoldering and soldering of BGA IC components, 1000W 500 C QUICK 861DW lead free rework station for mobile phone BGA desoldering repair. Hot Air Rework Station Lead Free Soldering Station For BGA IC Components Welding. 220V or 110V option voltage. Note: 110V, need customized, time: about 1-2 days. With 3pcs Heat Gun Nozzles - size : 5mm 6mm 8mm, if need 3mm 12mm nozzle, need bought it alone. More QUICK 861DW Nozzles Features : With CH1, CH2, CH3 three working channels, and each channel can be set to the amount of wind, and temperature. Password protection and key lock function. Facilitate real-time operation, with magnetic switch control lever is placed in the handle holder immediately into hibernation. With automatic sleep function, in a dormant state parameters can be set. Sensor closed loop, microcomputer zero trigger temperature control, power, heating quickly, easily and precisely adjust the temperature stable, free from the influence of wind. The use of brushless vortex blower, air flow adjustable, wide range, can be adapted to a variety of uses. The system has an automatic cooling function of wind capacity, extend the life of the heating element and protect the hot air handle. Specification : Power: 1000W Voltage: AC 220V 110V Temperature range: 100 C 500 C Air volume ratio range: 1 to 120 Maximum air flow: 120L min Dimensions: 188 (L) 245 (D) 135 (H) mm Package List : 1pcs x Quick 861DW rework station 1pcs x Hot air gun 1pcs x Hot air gun holder 3pcs x Heat gun nozzles 1pcs x Ground lead 1pcs x Instructions
Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power 5100W Max 2 Top heater power 1200W 1st heater¡ 3 Bottom heater power 1200W 2nd heater 4 3rd IR heater 2700W (independent controlling left and right IR heaters) 5 power AC 220V;¨¤10 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions 640¢630900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size Max 410 370mm¡; Min65 65mm 10 Available BGA chip 11- 80 80mm 11 External temperature sensor 1piece 12 Net weight 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power- 5100W Max 2 Top heater power- 1200W ¡ê¡§1st heater 3 Bottom heater power -1200W ¡ê¡§2nd heater 4 3rd IR heater- 2700W (independent controlling left and right IR heaters) 5 power-AC 220V10- 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions- 640,630,900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size- Max 410 mm Min65mm 10 Available BGA chip-180mm 11 External temperature sensor1piece 12 Net weight- 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Main features 1.Embedded industrial control computer,windows system. Adopt high definition human-machine interface, PLC control, there is password protection and modify function, can show 4-6 temperature curves and store multiple sets of data, with instant curves analysis function, and analyzing and correct BGA temperature at any time; 2.For guarantee the heating effect and mounting precision, control independently the top heater and mounting heat ,adopted linear slide make X,Y,Z axis can do micro adjustment and rapid positioning;after mounted, no need to move the PCB board in the bottom area, it can heat directly when move the top heater, avoid the moving of bga placement when move the PCB. Ensured the mounting accuracy and welding effect. 3.top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time, three heaters control independently. Show the heat time, temperature, and curves act, on the touch screen. 4.choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system control temperature precisely through PLC and temperature module, keep the temperature deviation at 2 degree.external temperature measuring interface check temperature precisely, achieve accurate analysis and collate the actual temperature curve. 5.V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board. 6.Flexible and removable universal fixture the operator and the protective effects and no damage to the PCB board suitable for all kinds of sizes of BGA repair. 7.Adopted all kinds of BGA nozzles, with 360,227; rotation, easy for installation and replacement, customized is available; 8.Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image by hand or automatic. 9.The X, Y axis and R angle with micrometer adjust; alignment accuracy is within0.01mm, with high definition HD monitor, avoiding human operation errors completely. 10.There are 8 segments rising temperature and 8 constant temperatures, can store millions of temperature curves, curve analyze, set and modify on the touch screen. 11.With voice control ãalarm in advance .À function, 5-10 seconds before finished soldering and desoldering alarm the operators with voice control to prepare the related works. Powerful cross-flow fan cool the PCB board fast by hand or automatic after desoldering and soldering, it can prevent the PCB board from deformation, ensure the welding effect. 12.With vacuum pump,|¦Ìangle 60 rotation, micrometer precise adjust mounting and nozzle, need no air source. 13.With CE certification, there is emergency stop switch and automatic cut off protective device when abnormal situation happen. Specifications and technical parameters: 1 Total Power-4850W 2 Top heater-800W 3 Bottom heate-The second heat area 1200w, the third heat area 2700w (plus size area to suit any kinds of PCB board) 4 Power-AC220V 50/60Hz 5 Dimensions-L790W640H800 mm 6 Positioning-V-groove, PCB support can X,Y axis adjust at any direction, additional with universal fixture 7 Temperature control-K Sensor, Closed loop 8 Temperature accuracy-2 degree 9 PCB size-Max 370 x 410mm Min 22 x 22mm 10 Work bench fine-tuning-front and back 15mm, right and left 15mm 11 Camera magnification10x-100x times 12 BGA chip2*2-80*80mm 13 Minimum chip spacing-0.15mm 14 External Temperature Sensor1-5 pieces available to choose, optional 15 Placement Accuracy-0.01MM 16 Net weight-93kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Features introduce independent control heaters top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time. temperature accuracy within there are multi segments can be set at the same time; IR preheating area is adjustable according to desire requests, to make PCB heating evenly. it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom, to avoid PCB from deformation during repair process. The top and bottom heaters heat independently choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system it can show seven temperature curves and the millions of groups data can be saved through U storage device with instant curves analysis function and analyzing BGA temperature at any time; the sensor is for precise temperature testing. Precise optical alignment system Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, amplify to 230 X, mounting accuracy within 0.01mm. InMulti-function operation system Ù Adopt high definition human-machine interface, available for setting ¡°set up¡± and ¡°operate¡± to avoid error settings, The top heater device and mounting head 2 in 1 design, with automatic identify BGA chips and mounting height, it is of automatic soldering and desoldering function.it can set 6 segments rising temperature and 6 segments activity temperature, and can save N groups temperature profiles. Adopted all kinds of BGA nozzles, with 360 rotation, easy for installation and replacement, customized is available; ÚV-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board; Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of sizes of BGA repair. Superior safety functions With CE certification; after desoldering and soldering, there is alarming. when temperature goes out of control the circuit will automatically power off, it is of double over-temperature protection function. Temperature parameter has a password to avoid from arbitrary changes, with superior safety protection functions, can protect PCB board components and the machine from damage at any abnormal situation Specifications and technical parameters Total power 5300W Max Top heater power 1200W (1st heater) Bottom heater power 1200W (2nd heater) 3rd IR heater 2700W independent controlling left and right IR heaters) power AC 220VA10 50/60Hz Electrical materials temperature control system Adopted Dalian University of Technology Dimensions L640*W630*H900mm Temperature control K-type thermocouple (Closed Loop), intelligent temperature compensation system Positioning V type groove, with universal fixture P C B size Max 410A370mm, Min65A65mm Wooden box
WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard / How to replace a new BGA chip Repair steps 1.Separate the BGA chip from mother board -we called desoldering 2.Clean Pad 3.Reballing or replace a new BGA chip directly 4.lignment/Positioning -Depend on experience ,silk frame ,optical camera 5.replace a new BGA chip - we called Soldering
ZM-R5860 Hot Air BGA Rework Station ZM R5860C Hot Air BGA Rework Station is a kind of rework station provided by Zhuomao, which has three temperature zone Independently control, convection hot air heating, lower temperature zone height-adjustable, high-precision autonomous control system, high-precision K-type thermocouple with accuracy up to ± 3, dynamic APR multi-loop closed-loop control selective reflow process. Imported high power constant current integrated cooling fan. As one of the most reputable BGA Rework Station suppliers, Seamark ZM provides the best BGA Rework Station with good quality. If you want to know seamark ZM R5860 price, please contact us now! Functions of Zhuomao ZMR5860 Smart BGA Rework Equipment 01 Temperature Curve Setting High-definition touch screen operation, real-time display and, editing of temperature curves, each group of temperature curves can be set to 8 segments, 100 groups of temperature curves can be stored, with temperature self-organizing function. 02 Laser Red-dot Positioning Guide Laser indicator for PCB and component positioning. 03 Vacuum Adsorption The external vacuum suction pen is convenient for taking BGA. Specification Of Seamark Zhuomao BGA Rework Station Power Supply AC220V±10% 50/60HZ Power 5.0KW(Max), Top heater(0.8KW) Bottom heater (1.2KW), IR Preheater (2.7KW),Other(0.3KW) PCB Size 410*370mm(Max); 10*10mm(Min) BGA Chip Size 40*40mm(Max); 10*10mm(Min) IR Heater Size 375*285mm Temperature Sensor 1 pcs Operation Method 7" HD touch screen Control System Autonomous heating control system V1 software copyright Alignment System Laser dot Vacuum Adsorption Manual Temperature Control K-type thermocouple closed-loop control with accuracy up to ±3 Positioning V-groove with universal fixture Dimensions L635*W620*H655mm Weight 43.5KG Principle And Operation Mode Of Seamark ZM R5860 BGA Machine The Seamark ZM R5860 BGA Machine is a rework station used for soldering and desoldering ball grid array (BGA) components on printed circuit boards(PCBs).BGA components are a type of surface-mount packaging used for integrated circuits. Seamark Zhuomao ZM R5860 BGA Machine is based on the hot air rework technique. lt uses precisely controlled hot air to melt the solderballs of the BGA component allowing it to be removed or replaced without damaging the PCB or the component itself. The machine also uses a vision alignment system to accurately align the BGA component with the PCB. The Seamark ZM R5860 BGA Machine allows for precise control over the temperature and airflow, ensuring a reliable and high-quality soldering/desoldering process. lt is suitable for use with a wide range of BGA components and PCBs. The operation mode of the Seamark ZMR5860 BGA Machine involves several steps: Preheating: The PCB is preheated to a suitable temperature to prevent thermal shock to the board when the hot air is applied.
Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply¡ê;no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400 230; (Max) Preheating temp. 400 Positioning V-groove +laser positioning + universal fixture PCB size Max 410 370 mm Preheaing size 370mm 270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80¨80mm Min 22 mm Dimensions L640 W630 H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400(Max) Preheating temp. 400Max Positioning V-groove +laser positioning + universal fixture PCB size Max 410 ,370 mm Preheaing size 370mm,270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80,80mm Min 22 mm Dimensions L640 W630 ,H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
WDS-750 higher automatic bga rework station https://youtu.be/5fbCW4nN3w4 Features of WDS-750 1.touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use; 2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield. 3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling; 4.auto feed chip,auto pick up chip,auto belowing chip,can identify the central position automatically when optical alignment; 5.multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users; 6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 â?? 7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm; 8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users. 9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts. 10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional). WDS-750 parameter Total power:6800W Upper heating power:1200W Bottom heating power:1200W Bottom IR heating power:4200W2400W is controlled Power supply:(Single Phase) AC 220V±10 50Hz Location way :Optical camera+ V-shape card slot + laser position for fast location Temperature control:High precision K sensor closed loop control,independent temperature control with ±1 â?? precision Appliance selection:High sensitive touch screen + temperature control mode +Panasonic PLC +step driver Max. PCB size:500Ã?450mm Min. PCB size:10Ã?10mm Sensor:4units Chip amplification multiple:2-30X PCB thickness:0.5-8mm Chip size :0.3*0.6mm-8cm Min. chip space:0.15mm Max. mount loading:500G Mount precision:±0.01mm Overall size :L670Ã?W780Ã?H850mm Optical camera:Can be removed front and back,left and right,prevent the dead angle Machine weight :90kg
