Supplier: Textile products, colour dyes, handloom products, cotton yarns, fabrics, agro chemicals, organic chemicals, inorganic chemicals, pesticides, plastic household products, plastic polymers, fibers raw materials, fibers products, engineering products, mineral & metallurgy products, electronic products, consumer electronics products, cereals, halal products, dairy products, stationary products, beauty and cosmetics products, furniture, gardening tools, tiles & sanitaryware, flavour and fragrances, construction products, kraft paper rolls, grocery items, kitchen utensils, pipes & fittings, paper and pulps products, spices, empty glass bottles, stainless steel products, hardware products, and many more.
Supplier: All food products, fruits, cereals, sona masoor rice, basmati rice, turmeric, pigeon pea, cardamom, coconuts, construction materials like granite, cement, fly ash, iron, steel, electronic goods, automobiles, etc.
Services: Packing, transportation, quality checking, laboratory testing reports, weights and measurement reports.
Application field: Telephone drop wire, Coaxial cable, CATV cable, Tracer wire, Railway cable, Automotive cable,Consumer electronics Size available: 0.06mm-6.54mm Temper offered: Hard drawn /Annealed Strength offered: Low carbon, High strength, Extra high strength. Standard: ASTM B227 Package: Wire will be loaded on steel spool with 100kgs, 300kgs ,500kgs,750kgs per unit and put on plywood pallets which is suitable for sea transportation. (Both eye to wall and eye to sky is acceptable.)
Supplier: Steel shot, steel grit and glass bead for blasting
Supplier: Steel, Electronic And Novelty
Buyer: Steel, Gadgets, Electronic And Novelties
Supplier: Grocery, electronics, lifestyle & steel materials
Buyer:
Product: Solder Ball Product composition: tin 99.3 copper 0.7 Product size: 13mm 19mm 22mm customizable Product weight: can be customized Solder ball is an indispensable and important material in new packaging. It is a new connection method that meets the requirements of electrical interconnection and mechanical interconnection. Due to the rapid development of BGA and CSP in recent years, it has replaced the traditional pin package and lead frame package, thus playing an important role in electrical interconnection and mechanical support in solder balls. BGA, CSP and other packaged devices connected by solder balls are widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs and 3C products. This provides a broad application market and development prospects for solder ball products.
Supplier: Electronics & mobile, steel furniture
Services: Logistics
Buyer: Electronics & mobile, steel furniture
Supplier: Stainless steel, mild steel, hardware, electronics and electrical goods
Services: Construction, interior designer, architects
Buyer: Stainless steel
Supplier: Steel sheets, billets, scrap, electronics, equipment
