BGA Rework Station Zhuomao bga rework station china is one of the best BGA rework station suppliers in China. First of all, what is BGA machine? BGA rework/repair station is what we called ball grid array rework station, also abbreviated as BGArs. BGA is a chip packaging technology, which is applied to improve the performance of digital products and reduce the volume of products through the ball grid array structure. All digital products through this BGA machine china technology will have common characteristics, that is, small volume, strong performance, low cost, and powerful function. BGA rework machine is the exact equipment used to repair BGA chips. According to the operation requirements, we have launched different BGA rework machines that enjoy a good reputation from our clients all over the world recently.
hot air rework desoldering station is a professional phone repair rework station, desoldering and soldering of BGA IC components, 1000W 500 C QUICK 861DW lead free rework station for mobile phone BGA desoldering repair. Hot Air Rework Station Lead Free Soldering Station For BGA IC Components Welding. 220V or 110V option voltage. Note: 110V, need customized, time: about 1-2 days. With 3pcs Heat Gun Nozzles - size : 5mm 6mm 8mm, if need 3mm 12mm nozzle, need bought it alone. More QUICK 861DW Nozzles Features : With CH1, CH2, CH3 three working channels, and each channel can be set to the amount of wind, and temperature. Password protection and key lock function. Facilitate real-time operation, with magnetic switch control lever is placed in the handle holder immediately into hibernation. With automatic sleep function, in a dormant state parameters can be set. Sensor closed loop, microcomputer zero trigger temperature control, power, heating quickly, easily and precisely adjust the temperature stable, free from the influence of wind. The use of brushless vortex blower, air flow adjustable, wide range, can be adapted to a variety of uses. The system has an automatic cooling function of wind capacity, extend the life of the heating element and protect the hot air handle. Specification : Power: 1000W Voltage: AC 220V 110V Temperature range: 100 C 500 C Air volume ratio range: 1 to 120 Maximum air flow: 120L min Dimensions: 188 (L) 245 (D) 135 (H) mm Package List : 1pcs x Quick 861DW rework station 1pcs x Hot air gun 1pcs x Hot air gun holder 3pcs x Heat gun nozzles 1pcs x Ground lead 1pcs x Instructions
Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power 5100W Max 2 Top heater power 1200W 1st heater¡ 3 Bottom heater power 1200W 2nd heater 4 3rd IR heater 2700W (independent controlling left and right IR heaters) 5 power AC 220V;¨¤10 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions 640¢630900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size Max 410 370mm¡; Min65 65mm 10 Available BGA chip 11- 80 80mm 11 External temperature sensor 1piece 12 Net weight 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power- 5100W Max 2 Top heater power- 1200W ¡ê¡§1st heater 3 Bottom heater power -1200W ¡ê¡§2nd heater 4 3rd IR heater- 2700W (independent controlling left and right IR heaters) 5 power-AC 220V10- 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions- 640,630,900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size- Max 410 mm Min65mm 10 Available BGA chip-180mm 11 External temperature sensor1piece 12 Net weight- 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Main features 1.Embedded industrial control computer,windows system. Adopt high definition human-machine interface, PLC control, there is password protection and modify function, can show 4-6 temperature curves and store multiple sets of data, with instant curves analysis function, and analyzing and correct BGA temperature at any time; 2.For guarantee the heating effect and mounting precision, control independently the top heater and mounting heat ,adopted linear slide make X,Y,Z axis can do micro adjustment and rapid positioning;after mounted, no need to move the PCB board in the bottom area, it can heat directly when move the top heater, avoid the moving of bga placement when move the PCB. Ensured the mounting accuracy and welding effect. 3.top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time, three heaters control independently. Show the heat time, temperature, and curves act, on the touch screen. 4.choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system control temperature precisely through PLC and temperature module, keep the temperature deviation at 2 degree.external temperature measuring interface check temperature precisely, achieve accurate analysis and collate the actual temperature curve. 5.V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board. 6.Flexible and removable universal fixture the operator and the protective effects and no damage to the PCB board suitable for all kinds of sizes of BGA repair. 7.Adopted all kinds of BGA nozzles, with 360,227; rotation, easy for installation and replacement, customized is available; 8.Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image by hand or automatic. 9.The X, Y axis and R angle with micrometer adjust; alignment accuracy is within0.01mm, with high definition HD monitor, avoiding human operation errors completely. 10.There are 8 segments rising temperature and 8 constant temperatures, can store millions of temperature curves, curve analyze, set and modify on the touch screen. 11.With voice control ãalarm in advance .À function, 5-10 seconds before finished soldering and desoldering alarm the operators with voice control to prepare the related works. Powerful cross-flow fan cool the PCB board fast by hand or automatic after desoldering and soldering, it can prevent the PCB board from deformation, ensure the welding effect. 12.With vacuum pump,|¦Ìangle 60 rotation, micrometer precise adjust mounting and nozzle, need no air source. 13.With CE certification, there is emergency stop switch and automatic cut off protective device when abnormal situation happen. Specifications and technical parameters: 1 Total Power-4850W 2 Top heater-800W 3 Bottom heate-The second heat area 1200w, the third heat area 2700w (plus size area to suit any kinds of PCB board) 4 Power-AC220V 50/60Hz 5 Dimensions-L790W640H800 mm 6 Positioning-V-groove, PCB support can X,Y axis adjust at any direction, additional with universal fixture 7 Temperature control-K Sensor, Closed loop 8 Temperature accuracy-2 degree 9 PCB size-Max 370 x 410mm Min 22 x 22mm 10 Work bench fine-tuning-front and back 15mm, right and left 15mm 11 Camera magnification10x-100x times 12 BGA chip2*2-80*80mm 13 Minimum chip spacing-0.15mm 14 External Temperature Sensor1-5 pieces available to choose, optional 15 Placement Accuracy-0.01MM 16 Net weight-93kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard / How to replace a new BGA chip Repair steps 1.Separate the BGA chip from mother board -we called desoldering 2.Clean Pad 3.Reballing or replace a new BGA chip directly 4.lignment/Positioning -Depend on experience ,silk frame ,optical camera 5.replace a new BGA chip - we called Soldering
Atten ST-2090D 80W Thermostatic Digital Rapid Heating Welding Rework Station Soldering Iron Kit with Soldering Wire Holder, ATTEN ST-2090D Multi-function Digital Thermostatic 80W Lead-free Original Soldering Station for Cellphone BGA SMD PCB IC Repair. Features: Max Power of 80 W, soldering iron 28 V AC Temperature read out in MCU controlled temperature calibration. Soldering station with solder wire stand. Auto-standby, Auto-shutdown function are available. Heating wire and sensor use PTC materials. Soldering tip designed separate from heater and using common T900 series to save use-cost. Very fast heating: from room temperature to 350 C only approx. 15 s Soldering iron with flexible connection cable Adjustable temperature range 80 - 480 C Specification: Model: ST-2090D Power consumption: 80W Input voltage: AC 220V Output voltage: AC 24V Display method: LED Temperature range: 80~480 (176 896) Temperature offset range: 50 (90) Temperature stability: 2 at idle temperature Tip to ground resistance:
Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply¡ê;no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400 230; (Max) Preheating temp. 400 Positioning V-groove +laser positioning + universal fixture PCB size Max 410 370 mm Preheaing size 370mm 270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80¨80mm Min 22 mm Dimensions L640 W630 H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400(Max) Preheating temp. 400Max Positioning V-groove +laser positioning + universal fixture PCB size Max 410 ,370 mm Preheaing size 370mm,270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80,80mm Min 22 mm Dimensions L640 W630 ,H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
