Number of layer: 1-40L(Rigid Flex 1-26L)
Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ-6OZ(18mil-210mil)
Board thickness: 0.2-7.2mm(8mil-282mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: 100% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: 1000*600mm for Single and double side, 600*600mm for multi-layer
Min panel size: 10*10mm
Hole center position tolerance: ±0.05mm
- 32bit MCT of STM32 series mounted first in Korea
- Consistent welding output even at ±15% change in input power
- Consistent delivery speed regardless of any change in load current
- Zero damage on PCB pattern through mutual disconnection of the control
cable welding power of single cable
- 1-year warranty service first in Korea; After sales services at lowest price
after the 1-year warranty service; Support for S/W upgrade
- Applicable to the wiring method of all the domestic transformers
- Strong protective circuit built-in (Breaking overheat, Breaking overcurrent,
Protection of phase disconnection), which prevents damage on SCR and transformer
- Fan and magnet power-saving circuit built-in
170964 Communication Pcb Suppliers
Short on time? Let Communication Pcb sellers contact you.
Motor Control Board
Product use: Car
Layers: 6L
Material: NANYA
Thickness:1.0
Copper:1/1/1/1/1/1
Surface:ENIG
HYY PCB current monthly production capacity is 20,000 square meters which covers 2-24 layers Normal PCB, Heavy Copper PCBs, Hybrid PCB, Super thick and Thin PCBs.
The communication backplane PCB is made of isola 370hr material. The communication backplane bus is a high-speed data path between the PLC host and the I / O expansion module, supporting the I / O data refresh between the host and the expansion module. The technical level of backplane bus determines the I / O expansion ability of PLC products, which is the core technology of PLC design and manufacturing.
At present, the PCB board of PLC mostly uses isola 370hr material, and PLC mostly uses serial communication technology to realize backplane bus. Compared with parallel bus, serial bus has less leads and low hardware cost, and is not easy to be interfered. Serial bus can improve the reliability of automatic equipment in harsh factory and industrial environment.
In the field of communication PCB, it is widely used in wireless network, transmission network, data communication and fixed network broadband. Related products include backplane, high-speed multilayer board, high-frequency microwave board, multi-functional metal substrate, etc.
Serial Communication: A 10 pin FRC box header with TTL UART Pins are available for serial communication. RS232 adaptor PCBs as shown below are available for easy interface for connecting to a PC.
LED Display: 6 digit Common anode seven segment display. A 16pin FRC box connector is provided on the PCB for this purpose. Apart from segment (weight) display it will also drive a LED that indicates the presence of mains supply.
Buzzer annunciation: The buzzer is used for multiple annunciations. A few are mentioned below... a. Beeps with scrolling banner display. b. Beeps while TARE key is pressed. c. Intermittent & continuous beeps for set-point1 & set-point2 function.
PCB, PCB board, communication PCB, automobile PCB, medial PCB, power supply PCB, industry PCB, security PCB, military PCB, consumer PCB, printed circuit board, led pcb, normal PCB, high precision circuit board, heavy copper PCB, hybrid PCB.Transportation
1.We make the tooling by ourselves according to customer's drawing or sample
2.We send samples to customer to confirm first
3.Lifetime:forever,we maintain freely
Usage: Pole Brackets are used to support ADSS fittings of utility poles
Adopting the most advanced microvia technology and ultra-fine line design, HDI PCB is a core substrate designed for miniaturised electronic products such as smartphones, wearable devices, medical electronics and high-end communication devices.
HDI PCB technical advantages and capabilities
1. High-order interconnect architecture Supports 1+N+1, 2+N+2, 3+N+3 and other multi-layer blind buried hole structure, the highest to achieve any-layer interconnect (Any-Layer), aperture diameter as low as 0.075mm, line width/spacing up to2mil/2mil (rigid board) and 0.025mm/0.025mm (flexible board), perfectly adapted to chip-scale packaging (CSP), system-in-package (SiP) and other cutting-edge technologies.
2. Ultra-thin dielectrics and fine lines Dielectric layer thickness is precisely controlled at 0.06-0.2mm, combined with ultra-thin copper foils (0.5-15oz inner layer, 0.5-10oz outer layer) to ensure signal integrity (SI) and power integrity (PI), and at the same time meet the requirements of chip-scale packaging (CSP), system-in-package (SiP) and other leading-edge technologies.Integrity (SI) and Power Integrity (PI), and at the same time meet the needs of thin and light designs (e.g., wearable devices, folding screen mobile phones).
3. Diversified surface treatment solutions Provide HASL (lead-free), ENIG (1-5" Au+80-200" Ni), electroless nickel-palladium-gold (ENEPIG), silver/tin immersion, etc., to adapt to harsh environments such as high temperature, high humidity, high frequency, etc., including hard gold plating (Au 1-50"/Ni 80-200" Ni).The hard gold plating (Au 1-50"/Ni 80-200") is especially suitable for connectors and wear-resistant contacts.
4. Flexible Circuits and Rigid-Flex Combination Flexible PCB (FPC) line width/spacing can be as thin as 0.025mm, with a bending radius as low as 0.1mm, supporting dynamic bending scenarios; Rigid-Flex Combination Boards (RBFBs) realise the seamless integration of rigid boards and flexible boards, and are widely used in drones, medical devices, and other applications. Widely used in drones, medical equipment and other high-reliability fields.
5. Mass production and quality assurance Monthly production capacity of 20,000 square metres, through the ISO 9001/14001/IATF 16949 system certification, equipped with AOI optical inspection, flying pin test and impedance control (�±10%) capabilities, to Ensure lead time and product yield.
Typical applications:
Motherboards and RF modules for smartphones/5G terminals
Wearable devices such as TWS headsets and smartwatches
High-end medical devices (e.g., portable ultrasound, implantable devices)
In-vehicle infotainment systems, ADAS sensor modules
Motherboards for high-performance servers and communication base stations.
We provide the following PCBs PCBs Multi layered type(up to 40 layers) Rigid(single and double sided) Impedance controlling type Flexible type We have not only experience to deliver major Japanese OEM but also export to Russia and China.
As a manufacturer of PCBs, Elecsound can offer reasonable prices, good quality and fast lead time. we can offer 1 layer PCBs, two layers PCBs, 4 layers PCBs and 6 layers PCBs. and we can offer HAL, OSP and immersion gold and so on. Rohs is valiable also. our lead time for 1 and 2 layers PCBs are 7 days. and 4 layers PCBs are 10--14 days. And pls note that we have no minimum quantity for PCBs,we can accept any quantity you need.The price will be competitive also.
Pls check if you need any pcbs. and don't forget to send me a "GERBER" file with qty to quote... I am waiting for your contact.
PCBs
Elecsound can offer single, double-sided, 4 layer to 8 layers.
