Advantage of Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8% http://en.hengxingchinese.com/ Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Advantage of P Type Polycrystalline Solar Wafer Manufacturer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3 s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Type Multi crystalline silicon wafer ( B grade) Size(mm) 156.6 (+0.0 to -0.5). P/N type P Do pant Boron Resistivity(ohmcm) 0.5 û 5.0 Carbon Content 5.0x1017 atoms per cm3 Oxygen Content 3.0x1017 atoms per cm3 Life Time > 1.5 microsecond. T T V less than or equal 50 microm. Thickness 200 microm(+/- 30 microm) Production(Casting) method EMC Diffusion length greater than or equal to 50 micrometer Conner angle(degree) 90.0 +/- 0.3 Beveled edge width 0.5 - 2 mm Appearance Chip ( Width 0.8 mm, less than or equal 4 points.
Advantage of High efficiency P Type Polycrystalline Solar Wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Advantage of P Type Polycrystalline Solar Wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs http://en.hengxingchinese.com/ Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Advantage of P Type Polycrystalline Solar Wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs http://en.hengxingchinese.com/ Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Name: High efficiency polycrystalline silicon block Technology :Semi-melting Type: P Type Resistance:1~3Ωcm minority carrier :>6μs Hem width:157.00~157.25mm Angle of Chamfer:1~2mm minority carrier:>2 μs Thickness:200±20μm Transfer efficiency:>18.8% Advantage of P Type Polycrystalline Solar Wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
top quality factory price 156x156mm 200um high quality High efficiency solar silicon wafers Manufacturer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Advantage of top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer ?The production process is simple, cost-effective, and reduces silicon waste ?High conversion efficiency, low fragmentation rate and low optical attenuation ?Manufacturing Specialization, Intelligence and Greening ?Customized products to meet customer
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8% Name: High efficiency polycrystalline silicon block Technology :Semi-melting Type: P Type Resistance:1~3©cm minority carrier :>6s Hem width:157.00~157.25mm Angle of Chamfer:1~2mm
Advantage of high quality P Type Polycrystalline Solar Wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3 s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20 m Transfer efficiency:>18.8%
Advantage of Sawing Wire for Solar Wafer Cutiing Very thin and tensile wires of low keff loss Hence more wafters per cut and less fractures Make higher productivity Tight diameter and ovality tolerances A wide range of spool types An advanced winding technology Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources. Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Advantage of Sawing Wire for Solar Wafer Cutiing -------- Very thin and tensile wires of low keff loss Hence more wafters per cut and less fractures Make higher productivity Tight diameter and ovality tolerances A wide range of spool types An advanced winding technology Hengxing Solar Wafer Cutting Diamond Multi-Wire Sawing Ultra Fine Steel Saw Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources. Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Advantage of High efficiency P Type solar silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of Hot Sales A Grade solar silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Solar Wafer Cutting wire Silicon Cutting Sawing Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
Solar Wafer Cutting wire Silicon Cutting Sawing Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
Advantage of Sawing Wire for Solar Wafer Cutiing Very thin and tensile wires of low keff loss Hence more wafters per cut and less fractures Make higher productivity Tight diameter and ovality tolerances A wide range of spool types An advanced winding technology Sawing wire for multi sawing solar wfter cutting Item: Sawing wire for multi-wire sawing Ultra Fine Wire Saw For Cutting High Hardness of Monocrystalline Silicon Shape:wire Material: Imported C-steel Coating:Brass,combinations Number of wires:1 wire Other Name: Solar Wafer Cutting wire Silicon Cutting Sawing Wire Diameter:65um-350um available
Item: Sawing wire for multi-wire sawing Ultra Fine Wire Saw For Cutting High Hardness of Monocrystalline Silicon Shape:wire Material: Imported C-steel Coating:Brass,combinations Number of wires:1 Diameter:65um-350um available 17 years of history in steel wire transforming and coating Listed on Shenzhen A stock market in 2007 An annual output of 10,000 tons of sawing wire ISO/TS 16949 And ISO9002 certificated Can provide all kinds of all kinds of the length of the wire, the line length subject only to the spool take-up capacity limit. H wheel type mainly includes NTC210 type, BS200, BS64, BS126, etc. According to customer needs to provide other specification size of h wheel.
Copper Cathode Item A IC grade scrap/broken/fallout silicon wafer (bare) Item B IC grade top & tails/pot scrap Item C Virgin poly crystalline silicon chunk/ chips/ granules from manufacture company Product: broken wafers, silicon scraps
