Motherboard Scrap Pcb Circuit Boards Suppliers and Manufacturers

Material : fr-4(high tg) Board thickness : 0.062" Layers : 6 Trace width/space : 5 mil/5 mil Via holes : 12 mil Application : sound system Vacuum package

Al material base circuit board Typical feature . Standard dimension: 490x8857; 490mm 600x8857; 500mm (optional dimension for discussion) . Standard thickness: 1.0, 1.5, 2.0, 3.0 mm(optional dimension for discussion) . Copper foil thickness: 35um, 70um, 105um, 140um, 210um . Heat conduction and insulating layer thickness: 60um Application Motor, auto-bicycle trigger, voltage adjustor Audio output magnifier Power supply, solid transistor base Industrial power Solar-energy batter base, heat sinker etc. Standard export carton

Flexible printed circuit board (FPC) General specification: Circuit sizes: Single sided up to 22" x 28" - (558. 8mm x 711. 2mm) Double sided up to 16" x 22" - (406. 4mm x 588. 8mm) Maxi-flex up to 10" x 16 feet - (254mm x 4877. 0mm) Hole size: Non-plated thru holes. 010" (. 25mm) min. Drilled hole size. Tolerance +/-. 0015" (. 038mm) Plated thru holes. 010" (. 25mm) min. Drilled hole size. Tolerance +/-. 003" (. 076mm) (smaller holes can be manufactured. ) Line width and spacing: . 005" (. 12mm) minimum line . 005" (. 12mm) minimum spacing (finer lines can be manufactured. ) Conductor to edge of circuit/blanking: Soft tooling outline dimensions +/-. 010" (. 25mm) Hard tooling outline dimensions +/-. 003" (. 076mm) Drill position: Tolerance of +/-. 003" (. 076mm) Layers: Up to 6 conductor layers Shielding layer - copper and silver Pads on plating layer Standard export carton

Two- to four-layer rigid-flex pcbs with fr4/hdi-pda laminate material Key specifications/special features: Number of layers: 2 to 4 Thickness: 12 mil only Thermal performance: 30% better conduction than standard 0.062-inch fr4 New fr4 technology from photo circuit New thermally conductive adhesive technology Suitable for body through power train controller application Standard export carton

386/486 ceramic cpu Pentium pro cpu Ceramic cpu Amd ceramic cpu K6/aluminum-cap ceramic cpu Black plastic cpu Plastic cpu Metalcap plastic cpu Slot cpu Ram. Gold ram Silver ram Circuit boards. Essentials Status launched Launch date q1'12 Processor number e5-2650 Of cores 8 Of threads 16 Clock speed 2 ghz Max turbo frequency 2.8 ghz Cache 20 mb Intel qpi speed 8 gt/s Of qpi links 2 Instruction set 64-bit Instruction set extensions avx Embedded options available No Lithography 32 nm Scalability 2s only Max tdp 95 w Vid voltage range 0.60v-1.35v Recommended customer price tray: $1112.00 Computer cpu scrap Memory specifications Max memory size (dependent on memory type) 750 gb Memory types ddr3-800/1066/1333/1600 Of memory channels 4 Max memory bandwidth 51.2 gb/s Ecc memory supported. Cpu and ram gold scrap Scrap ceramic gold-cap cpu -scrap ceramic cpu -scrap ceramic cpu with aluminum cap -scrap black plastic cpu -scrap plastic cpu's -ceramic pentium pro -cpu 486 ceramic

Trends driving the car of the future are all enabled by more complex and intelligent electronics. Advanced driver-assistance systems (ADAS), human-machine interface (HMI), electrification, and increased vehicle to vehicle (V2V) and vehicle to infrastructure (V2I) connectivity rely on advanced electronics and sensing components. Electronics for automotive that must be produced at the highest quality levels, and quite literally, cannot fail.

JinSung Electronics prides itself on the ability to support all levels of flex interconnect technology requirements that are truly helping to save lives and improve quality of life. For JinSung's entire twenty-five years of flex interconnect fabrication service dedication to the field of medicine has been a key drive and focus. With innovation and collaboration with our customers, JinSung has produced flex and rigid-flex printed circuit boards that help to combine more functionality, ease of operation and smaller package size to doctors and health professionals.

1. UL/ISO9001 Certified 2. Fast production 3. No MOQ/MOV 4. Fast quote

Backed by rich industry experiences, we are leading Manufacturer and Supplier of Customized Integrated Circuit Board in Wuhan, Hubei, China. Folysky Technology is dedicated to providing the polishing of advanced materials to surface finishes and supplier quality levels that consistently meet or exceed our customer�¢�?�?s expectations. Advanced level polishing requires that appropriate abrasive and pre-lapping conditions be used to significantly reduce sub-surface damage. Centerline uses both mechanical and CMP (chemical mechanical process) depending on the customers requirements. We are constantly looking for ways to enhance the processes that we have already established, while maintaining careful process controls and qualifications. Industry standard materials polished are 99.6% Alumina, 96% Alumina, AlN, BeO, Sapphire, Fused Silica. Centerline polishes virtually any ferrous or non ferrous material. Centerline Technologies�¢�?�? polishing process controls the surface finish and, combined with our lapping process, assures thickness identity and parallelism, as well as flatness of substrates. Our lapping and polishing processes are custom designed for each type of material and the physical dimensions required

Layer:1~22 layers Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating Max.Panel Size: 550 * 650mm Min. Finished Holes Size: 0.10mm Microvias diameter: 0.10 - 0.15mm Min. Line Width/Spacing: 0.075 / 0.075mm Copper Feature to Holes(Outer): ±0.075mm Min. Plated Drills to Copper (inner): 0.25mm Min. Copper to Edge distance: 0.25mm Max. Copper Thickness: 140μm Max. Board Thickness: 4.80 mm Min Board Thickness: 0.20mm Min. Core Thickness: 0.10mm Min. Soldermask Dam: 0.10mm

we can do 2L-8L boards normal size

Application:led bulb Base Material:FR4 Board Thickness:1.75mm Min. Hole Size:0.20mm Copper Thickness:1 OZ Layer:2 Layers Surface treatment:HASL Etc Solder mask color:White Silkscreen color:Black

Number of Layers: 1-14Layer Base Material: FR4 Copper Thickness: 0.5oz-6oz Board Thickness: 0.2mm-7mm Min. Hole Size: 0.2mm Min. Line Width: 0.075mm (3mil) Min. Line Spacing: 0.075mm (3mil) Surface Finishing: Immersion Gold, HASL, OSP, Enig, Gold Fingers, etc Board Size: Multilayer Quality Control: FQC, FQA Services: EMC, ODM, OEM Testing Service: Aoi X-ray Function Test Certificate: UL, TS16949, ISO9001, RoHS, SGS

Technical description: Board material: Al Board thickness:1.5mm Copper thickness: 1oz Thermal conductivity:1.5W/MK Withstanding voltage: 2000V Solder resist: white Surface finishing: HASL Why choose us: We can do PCB fabrication, component assembly, wire harness assembly, box assembly, component forming and electrical testing Certificate: ISO 9001 Compliant with the RoHS Directive We purchase material from original company and distributes We make products by strict engineering processes We have strict inspection processes We send products by antistatic package and carton box

Circuit board to take off the tin electronics equipment With electronic components of the circuit board by conveyor to close the wind into the feeding roller and feed preheating chamber. The device containing waste gas exports the back-end and exhaust gas treatment device, again for exhaust gas purification, discharging standard. Tin rate can reach about 99% off the equipment, electronic components rate can reach about 95%. Through this device can take electronic components of the circuit board is divided into: solder, electronic components, electronic components and circuit board larger. Circuit board to take off the tin electronics equipment

REPAIR OCLOCK T-003 universal PCB holder fixture for cellphone motherboard soldering repair, multi-functional REPAIR OCLOCK motherboard fixture with the rotation clamp, so it can be applied to any motherboard Features : It's made of high temperature-resistant material: synthetic stone splint, aluminum material. Steady clamp. Non-slip wheel. Break revolution close rotate. Available for Android/iPhone Mainboard Multi-functional fixed mobile phone motherboard/chip repair operation

Class 1-A PCBs are old PCBs with galvanically gold-plated contacts / connector strips, very many small and densely placed chips, mostly from old mainframe computers / servers. The circuit boards must not be stripped, attachments such as metal sheets, frames and heat sinks are removed.

4 layer board, blud soldermask, immersion gold surface finishing. Depend on customer requirements.

2 layers rigid-flex pcb Minimum line width/space: 8mils Surface finish: immersion gold Board thickness: 0.50mm Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.10mm flexible pcb inside Carton