Thermal Gap Pad Vs Bergquist Gap Pad 5000S35 Suppliers and Manufacturers

GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, its higher than that of most of competitor. Comparing with Bergquist gap pad 5000S35, the data will shows that GLPOLY thermal gap filler pad can perfectly replace the BQ 5000S35. Firstly, the thermal conductivity of GLPOLY thermal gap filler pad is higher that that of BQ 5000S35; the thermal resistance is only 0.16in2/W, its just one third of BQ 5000S35. Comparison data reflects that GLPOLY thermal gap filler pad offers more excellent thermal performance than BQ5000S35. For the electrical property, the dielectric breakdown voltage is 16KV, its 3 times greater than BQ 5000S35s. this will ensure the stability of performance of devices. The material yields extremely soft characteristics while maintaining elasticity and conformability. Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile components. The inherent natural tack on both sides assists in application and allows the products to effectively fill gaps, reducing thermal resistance and enhancing the overall thermal performance. GLPOLY thermal gap filler pad is ideal for high-performance application at low stress or pressure. Features Ultra conformability Designed for low-stress applications Fiberglass reinforced for puncture, shear and tear resistance ThicknessMm---- 0.3~5.0 Densityg/cm3---- 2.6 ,HardnessShore 00--20,20 Thermal Conductivity W/m*K--2.0,2.8

Thermal Gap Pad, thermal pad, thermal gap filler GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, its higher than that of most of competitor. Comparing with Bergquist gap pad 5000S35, the data will shows that GLPOLY thermal gap filler pad can perfectly replace the BQ 5000S35. Firstly, the thermal conductivity of GLPOLY thermal gap filler pad is higher that that of BQ 5000S35; the thermal resistance is only 0.16in2/W, its just one third of BQ 5000S35. Comparison data reflects that GLPOLY thermal gap filler pad offers more excellent thermal performance than BQ5000S35. For the electrical property, the dielectric breakdown voltage is 16KV, its 3 times greater than BQ 5000S35s. this will ensure the stability of performance of devices. The material yields extremely soft characteristics while maintaining elasticity and conformability. Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile components. The inherent natural tack on both sides assists in application and allows the products to effectively fill gaps, reducing thermal resistance and enhancing the overall thermal performance. GLPOLY thermal gap filler pad is ideal for high-performance application at low stress or pressure. Features Ultra conformability Designed for low-stress applications Fiberglass reinforced for puncture, shear and tear resistance ThicknessMm---- 0.3~5.0 Densityg/cm3---- 2.6 ,HardnessShore 00--20,20 Thermal Conductivity W/m*K--2.0,2.8

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