Hex Boron Nitride Ceramic Bn Suppliers and Manufacturers

Hex boron Nitride 99% contant 1-3um 1KG/BAG 20KG/BOX OEM welcome

Boron Nitride Ceramics Boron nitride ceramics are made by hot pressing boron nitride powders at high temperature and pressure�¯�¼? they can easily be machined into rods, bars, plates and even intricate custom shapes. The excellent highly exceptional thermal, physical and chemical characteristics of boron nitride ceramics make it ideal for solving tough challenges in a wide range of industrial applications.�?�  Excellent thermostable performance (Temperature �¢?�¥ 2000�¢?? in vacuum and inert atmosphere) Excellent thermal shock resistance Excellent lubricating properties High thermal conductivity High electrical resistivity Good chemical inertness Non-wetting (without oxidation) Excellent machinability It is widely used in many fields The ceramics are hard and can be made into high-speed cutting tools and drill bits used in geological exploration and oil drilling. Different shapes, can be used for high temperature, high voltage, insulation and heat dissipation components. Ceramics can be used to make packaging materials to prevent neutron radiation. Ceramics can be used to make special electrolysis and resistance materials under high temperature conditions. We can make different shapes of ceramics according to your requirements and your drawing, welcome and looking forward for your inquiring!

Granule 1-4mm 99.99%

Si3N4 Ceramic Substrate Manufacturer,Silicon Nitride Ceramic For IGBT,Power Module Substrates,LED Substrate Product Description Silicon Nitrides (Si3N4) Feature An Excellent Combination Of Material Properties. They Are Nearly As Light As Silicon Carbide (SiC), But Their Microstructure Gives Them Excellent Thermal Shock Resistance And Their High Fracture Toughness Makes Them Resistant To Impacts And Shocks. Properties Of Silicon Nitride (Si3N4) Very Low Density (3.21 G/Cm3) Very High Fracture Toughness (7 MPam1/2) Good Flexural Strength (850 MPa) Very Good Thermal Shock Resistance: High Thermal Stress Parameters (569 K) Maximum Operating Temperature In An Oxidizing Atmosphere: 1,300°C Maximum Operating Temperature In A Neutral Atmosphere: 1,600°C Feature High Strength (High Reliability) Similar To The Thermal Expansion Coefficient Of Semiconductors Such As Si, SiC, And GaN High Dielectric Strength High Bending Strength Main Use Of Precision Ceramics For Electronics (Si3N4=Silicon Nitride) Power Module Substrates LED Substrates Submount For Optical Pick-Up Heat Dissipation Substrates The porous silicon nitride ceramic material combines the excellent properties of both the silicon nitride ceramic and the porous ceramic and is a ceramic material having a communicating or closed pore in the body. Porous silicon nitride ceramics have been widely used in aerospace and environmental chemicals due to their special structure and properties, such as low density, high porosity, moderate dielectric properties, high specific surface area, high hardness, and high fracture toughness. Important fields such as biomedicine, national defense, and military.

We strictly control the raw materials and produce the prilling powders for ourselves. The density of our SiC tiles can be above 3.14g/cm3, and hardness above 2650N/mm2, which reached the international advanced level. Our quality armor SiC tiles have exported too many countries, we all get very good feedbacks. Our newly developed 250¡Á300mm monolithic SiC armor plate also gives our clients more choices. We produce boron carbide ceramics for armor use of various shape and size.

BN Boron Nitride is often referred to as white graphite because it has a microstructure similar to that of graphite. However, unlike graphite, boron nitride is an excellent electrical insulator that has a higher oxidation temperature. It offers high thermal conductivity and good thermal shock resistance and can be easily machined to close tolerances in virtually any shape. After machining, it is ready for use without additional heat treating or firing operations. In inert and reducing atmospheres, BN will withstand temperatures over 2,000°C. It is commonly used as an insulator in contact with tungsten and graphite electrodes at those temperatures. All Boron Nitride grades can be used in oxidizing atmospheres up to 750°C. It is not wet by most molten metals and slags and can be used in contact with most molten metals including aluminum, sodium, lithium, silicon, boron, tin, germanium, and copper. Boron Nitride is available in a variety of solid grades, differentiated by binder and composite: BN-2000, BN-2300, BN-2800, BN-3000...

Hexagonal Boron Nitride has the same type of layer structure as graphite and provides a very good lubrication/mold-release characteristic. BN is stable up to approximately 2000°C in the inert atmosphere.Besides, Boron Nitride is stable against most organic solvents and corrosive chemicals, and unwettable by most molten metals and glasses. Boron Nitride has high electrical insulation and voltage resistance at high temperature and no changes in permittivity and dielectric loss up to high-frequency area. As for its lubricity and mold-release efficiency, friction coefficient of Boron Nitride does not change up to considerably high temperature in nitrogen atomosphere, which enables use up to approximately 950°C in the air. What's more, because of high thermal conductivity and high heat radiation, BN can be applied to various kind of heat radiators.

A960 Alumina offers consistently reliable and convincing performance even when subject to high thermal and electrical loads in terms of its: Thermocycling capability, Thermal shock resistance, Flexural strength, Surface quality, Thermal conductivity. This makes A960 Alumina Ceramic Substrates ideal for power electronics in conjunction with direct copper bonding (DCB) and active metal brazing (AMB). ALN Aluminum Nitride - with outstanding insulating properties and extremely high thermal conductivity (â?¥ 170 W/mK), Aluminum Nitride is perfect for the extremely high performance required in the electronics industry. AlN ceramic enables the compact, affordable construction of components and hybrid designs with high integration density. Extraordinary mechanical strength and a low thermal expansion coefficient enable seamless system integration.

Wear resistant alumina mosaic plate also named ceramic lining pieces mats consist of small plate glued on acetate silk or other special medium. Alumina mosaic plate offer long wear life in .applications with sliding wear .the thickness and the low weight make these products ideal in applications where weight and space are limiting factors. Chemshun high alumina ceramic mosaics in a variety of sizes and shapes including square and hexagonal shapes . Dimensions range from 500*500mm ,300*300 mm, various plant components can be lined quickly and easily with these mosaic plate . :(alumina ceramic cylinder characters ) High hardness with Moh’s hardness 9 grade High abrasion and chemical resistance Easy installation by epoxy resin glue water Easy mending if someone hex tile drop off Various of alumina ceramic hex sheet size available

boron nitride ceramics The boron nitride crystal belongs to the hexagonal crystal system, which is similar to graphite in structure and performance, so it is also called "white graphite". It has good heat resistance, thermal stability, thermal conductivity, high temperature dielectric strength, and is an ideal heat dissipation material and high temperature insulation material. Boron nitride has good chemical stability and can resist the erosion of most molten metals. It also has good self-lubrication. Boron nitride products have low hardness and can be machined with an accuracy of 1/100 mm. Boron nitride can be used to make crucibles for smelting semiconductors and high-temperature vessels for metallurgy, semiconductor heat dissipation insulation parts, high-temperature bearings, thermowells and glass forming molds.

aluminium nitride ceramics The color of high thermal conductivity aluminum nitride ceramic sheet is gray white, and the surface is smooth. It can be made into any shape or size for easy use and installation. Aluminum nitride ceramic heat sink has a very high thermal conductivity, which is 7-10 times higher than that of aluminum oxide ceramic, and can reach 180W. Its electrical insulation performance is quite stable, its dielectric constant and dielectric loss are low, and it can withstand the ultra-high temperature of 1800 degrees Celsius without affecting the working performance of the product With the rapid development of electronic equipment, the demand for electronic or auxiliary products is also increasing, and the application rate of high thermal conductivity aluminum nitride ceramic heat sink as a matrix or packaging material is also increasing in the market.

silicon nitride ceramics Silicon nitride ceramic is an inorganic material ceramic that does not shrink during sintering. The strength of silicon nitride is very high, especially hot-pressed silicon nitride, which is one of the hardest substances in the world. It has high strength, low density, high temperature resistance and other properties. High temperature resistance, the strength can be maintained to a high temperature of 1200 without decreasing, and will not melt into a molten body after being heated, and will not decompose until 1900 It has amazing chemical corrosion resistance, and can withstand almost all inorganic acids and less than 30% caustic soda solution, as well as many organic acids; It is also a high-performance electrical insulating material. Si3N4 can be used to manufacture ball bearings by virtue of its light weight and high rigidity. It has higher accuracy than metal bearings, generates less heat, and can operate in higher temperatures and corrosive media. The steam nozzle made of S ceramic has wear resistance, heat resistance and other characteristics, and it will not be obviously damaged after being used in 650 boiler for several months.

Technical Data Breaking Strength at Room Temperature 900Mpa Fracture Toughness at Room Temperature 6.0-8.0 Mpa.m1/2 Volume Density 3.20-3.4g/cm3 Volume Resistivity at Room Temperature 1014Ω.cm Relative Dielectric Constant at Room Temperature 6-7 Heat Conductivity 23-25W/m-k Thermal Expansion Coefficient 3.110-6/ Hardness HRA92-94 Main Performance Indexes of Silicon Nitride Ceramics: Performance Reactive Sintering Silicon Nitride Normal Pressure Sintering Silicon Nitride The Companys Hot Pressed Sintering Silicon Nitride Volume Density g/cm3 2.21 3.15 3.2~3.3 Bending StrengthMpa 137.3 490.3 900 Fracture Toughness (Mpa·m1/2) 2.17 4.71 6.0~8.0 Hardness (HRA) 87.0 92.0~94.0 Heat Conductivity Coefficient (W/m·k) 5.44 12.56 23~25 Thermal Expansion Coefficient 10-6 (RT~1200) 3.2 3.2 2.95~3

Boron Nitride(CAS:10043-11-5)

The long-term practical use proves that SG-28 Silicon Nitride Ceramic is very suitable for low-pressure casting machines and dosing furnaces. Compared with traditional cast iron, silicon carbide, carbon nitrogen materials and Aluminum Titanate, Silicon Nitride Ceramics have the best high-temperature strength and the service life can last for more than one year. The low wettability to aluminum liquid, makes the SG-28 Silicon Nitride Ceramic effectively reduce the slagging on the inner and outer walls of the riser tube, reduce the shutdown loss and maintenance. SG-28 Silicon Nitride Ceramic has excellent corrosion resistance, which can effectively reduce the pollution to the aluminum liquid, and improves casting quality.

Size: support customization Molds:support customization Sample:1 kg Bulk order : over 50kg if the product in stock. Customized product MOQ : 1Ton/2 Tons

cas no: 10043-11-5 1-30um

Boron nitride

LT1800 Aluminum nitride conductive ceramic sheet has high thermal conductivity 180W/m-k,one of the highest thermal conductivity materials in metallic materials (7~10 times of alumina ceramic sheet). Excellent mechanical properties, good processing, high precision, smooth surface, no microcracks, bending, etc. Low dielectric constant and dielectric loss, reliable electrical insulation performance. Non-toxic, high temperature of 1800 degrees, oil resistant, chemical resistant, and similar to the thermal expansion coefficient of silicon, without hygroscopic property, stable performance and high reliability in high temperature and high humidity. Along with the microelectronic devices, Features & Benefits: Extremely high thermal conductivity High temperature and high humidity Good insulation Good chemical stability Typical Applications: Application of optical communication devices High frequency microwave application Power electronic components LED industry Car electronic module The thermal module substrate For more , please kindly feel free to contact