Bopp adhesive tape, double side tissue tape, double side foam tape, double side cloth tape, pvc insulation tape.
Pvc insulation tape, pvc lane marking tape, pvc protecting tape, PVC warning tape, pvc harness tape, pvc easy-tear packing tape, masking tape, double side tissue tape, bopp packing tape-super clear, clear, dark brown, brown, psa for adhesive tape-water base, rubber base.
Printed adhesive laminated flexible packaging material.
Pressure sensitive adhesive tape.
PE foam tape, TPU film tape, tissue tape, PI tape, pet film tape, EVA foam tape.
Adhesive tapes.
--High temperature resistant tape around 200'C --Converting : Die-cutting, Sheeting, Slitting , Laminating . Rewinding, Printing
Masking tape: Die-cuting & by roll form are available
Double side tape, masking tape, electronic tape, packing tape.Trade, manufacturing, export
Tapes, adhesive tape, double-sided tape, tissue tape, pet tape, PVC hazard warning tape, non-substrate tape, PE foam tape, acrylic foam tape, tape.Die cutting services
All kinds of self adhesive tape.
Anti slip tape, d/s foam tape, opp tape, decoration tape, opp printed tape, paper lace tape, paper tape.
Two items for this series: 1.W/ electronic conductive adhesive 2. W/ Acrylic adhesive Technical Data WI-0101-AL65 Al. Foil 0.025mm/0.03mm 0.055 mm Acrylic -10~120 Yes WI-0101-AL80 Al. Foil 0.035mm/0.03mm 0.065mm Acrylic -10~120 Yes WI-0101-AL80 Al. Foil 0.05mm /0.03mm 0.08mm Acrylic -10~120 Yes
PET double side tape Tissue double side tape : White / Black
Differential tape, Double side tape, Sandwich Tape **The thickness of film and adhesion coating can be custom made. Model: SDK578 Film Thickness: 50μm Adhesion (Kg/inch) : 0.9 Feature : Very thick for wrapping bumping chips 5 Layers Structrue: 50 μm Fluoride PET Release Film ------------------------------------------- Silicone Asgesive 95μm (A) ------------------------------------------- 50 Polymide Film ------------------------------------------- Silicone Asgesive 55μm (B) ------------------------------------------- 50 μm Fluoride PET Release Film **Polyimide, D/S silicone adhesive/Sandwich tape - DSK/SDK Series. High temperature resistant, able to go through reflow, re-usable. Optional two sides with different adhesion, multi-functional.
1. Used with UV light exposure (with certain wave length), the adhesion is greatly reduced (irreversible reaction), the object is then easily removed/ picked up after operation. 2. Polyolefin and Polyester films are mostly used. Good for dicing and heat resistant purposes. 3. Used in wafer grinding,chip dicing,MLCC cutting,LED or semiconductor dicing. 4. Available with anti-static.
Differential tape, Double side tape, Sandwich Tape **The thickness of film and adhesion coating can be custom made. Model: SDK578 Film Thickness: 50μm Adhesion (Kg/inch) : 0.9 Feature : Very thick for wrapping bumping chips 5 Layers Structrue: 50 μm Fluoride PET Release Film ------------------------------------------- Silicone Asgesive 95μm (A) ------------------------------------------- 50 Polymide Film ------------------------------------------- Silicone Asgesive 55μm (B) ------------------------------------------- 50 μm Fluoride PET Release Film **Polyimide, D/S silicone adhesive/Sandwich tape - DSK/SDK Series. High temperature resistant, able to go through reflow, re-usable. Optional two sides with different adhesion, multi-functional.
Differential tape, Double side tape, Sandwich Tape **The thickness of film and adhesion coating can be custom made. Model: DSK565 Film Thickness: 0.164mm Adhesion (Kg/inch) : 0.05-0.10 / 0.8 Feature : One Side with High Adhesion Higher Side to Metal Carrier & Lower Side to PCB 1. Polyester, one side silicone and one side acrylic adhesive - SDA Series. Silicone adhesive for low surface energy materials. Acrylic adhesive for all material surfaces. 2. Polyimide, D/S silicone adhesive/Sandwich tape - DSK/SDK Series. High temperature resistant, able to go through reflow, re-usable. Optional two sides with different adhesion, multi-functional.
Film Thickness : 50m Adhesion (Kg/inch) : 0.2 Adhesive : Acrylic 35 Îm Feature : With Release Liner. For all kinds of semiconductor process.
1. Used with UV light exposure (with certain wave length), the adhesion is greatly reduced (irreversible reaction), the object is then easily removed/ picked up after operation. 2. Polyolefin and Polyester films are mostly used. Good for dicing and heat resistant purposes. 3. Used in wafer grinding,chip dicing,MLCC cutting,LED or semiconductor dicing. 4. Available with anti-static.
