With is high spatial resolution, this product allows mapping for metal contamination in the wafer. It realizes user-friendly structure through automation. It minimizes the maintenance and management cost by using a small amount of chemicals. With its short analysis time and mapping capacity, this product contributes to the improvement of productivity and yield through prompt response and prior detection to problems that occur in the process.
It is the equipment to provide the electron beam vertically to the evaporate surface using the electron beam gun, and it is used in the process of optical multi-layer films This is the process micro electro mechanical system (MEMS) known as the electron beam evaporation process Physical Vapor Deposition (PVD) The deposition process is used to open the data in the source and send those data to the basal board and also to form thin films or coating. Because this is inexpensive regarding the material cost and exhibits rather low process risk, PVD process is the chemical vapor deposition generally used for metal eposition. The process applying the deposition of thin films conducts modification with various kinds of surfaces wanted by the industry in order to provide data to the electronic industry for semicon doctor growth, reflection needing properties to the aerospace, environment to the permeability optics, surface protection from the board corrosion, and also thermal and chemical barrier coating.
Vacuum degassing chamber.
It is easy to use for the automation of analyzing processes. The overall efficiency of analysis increases with shortened time for analysis. The buffer zone keeps the process zone vacuum all the time, so the inflow of dirty gas from outside is minimized and the precision of analysis becomes maximized. Keeping the process zone vacuum delays the aging of heater components more than before, so it is good for cost reduction. The automation of analysis processes maximizes the utility of time of testing manpower. Minimizing the contact of samples for analysis to the outside minimizes contamination. The increase of analysis efficiency actualizes the dedtion of faultiness in advance, so it is possible to test the processes.
With is high spatial resolution, this product allows mapping for metal contamination in the wafer. It realizes user-friendly structure through automation. It minimizes the maintenance and management cost by using a small amount of chemicals. With its short analysis time and mapping capacity, this product contributes to the improvement of productivity and yield through prompt response and prior detection to problems that occur in the process.
Vacuum chamber.
Espec chamber.
Uhv chamber.
It is the equipment to provide the electron beam vertically to the evaporate surface using the electron beam gun, and it is used in the process of optical multi-layer films This is the process micro electro mechanical system (MEMS) known as the electron beam evaporation process Physical Vapor Deposition (PVD) The deposition process is used to open the data in the source and send those data to the basal board and also to form thin films or coating. Because this is inexpensive regarding the material cost and exhibits rather low process risk, PVD process is the chemical vapor deposition generally used for metal eposition. The process applying the deposition of thin films conducts modification with various kinds of surfaces wanted by the industry in order to provide data to the electronic industry for semicon doctor growth, reflection needing properties to the aerospace, environment to the permeability optics, surface protection from the board corrosion, and also thermal and chemical barrier coating.
DC magnetron sputter system.
Power : 3 phase Ac 220v Measure : 1550 x 2300 x 1420 (width*length*height) Weight : 900kg Servo axis : 6 axis Bending capacity : soft wire (2.5~7.0) Hard wire (1.8~4.0)
NM35 spring forming machine.
Power : 3 phase Ac 220v Measure : 1550 x 2300 x 1420 (width*length*height) Weight : 900kg Servo axis : 6 axis Bending capacity : soft wire (2.5~7.0) Hard wire (1.8~4.0)
Power : 3 phase ac 220v Measure : 1300 x 2650 x 1750 (width*length*height) Weight : 2270kg Servo motor : feeding (6kw 1500rpm) Bending (6kw 1500rpm) Rotation (6kw 1500rpm) Bending capacity : soft wire (3.5~10.0) Hard wire (3.0~6.0)
Power : 3 phase ac 220v 45kw Measure : 6200 x 1650 x 1650 (width*length*height) Weight : 4200kg Servo axis : 10 axis Bending capacity : odxt 70 x 2.5t
Power : 3 phase ac 220v 45kw Measure : 6200 x 1650 x 1650 (width*length*height) Weight : 4200kg Servo axis : 10 axis Bending capacity : odxt 70 x 2.5t
Power : 3 phase ac 220v Measure : 1600 x 2100 x 2060 (width*length*height) Weight : 3550kg Servo motor : working slide (3.0kw 1000rpm) Feeding (4.4kw 1000rpm) Wire rotate (4.4kw 1000rpm) Quill spin (0.8 kw 3000rpm) Spinner (1.0kw 3000rpm) Bending capacity : hard wire (1.0~3.5)
Type 1 L-N2, L-O2, L-Ar - Design Pressure : 2.0MPa - Volume Capacity(Nm/hr) : 100~1000Nm/hr - Material : A6063S-T5 Type 2 L-CO2 - Design Pressure : 2.3MPa - Volume Capacity(kg/hr) : 100~1000kg/hr - Material : A6063S-T5
Power : 3 phase ac 220v Measure : 1600 x 2100 x 2060 (width*length*height) Weight : 3550kg Servo motor : working slide (3.0kw 1000rpm) Feeding (4.4kw 1000rpm) Wire rotate (4.4kw 1000rpm) Quill spin (0.8kw 3000rpm) Spinner (1.0kw 3000rpm) Bending capacity : hard wire (1.0~2.5)
Power : 3 phase AC 220v Measure : 1360 x 3200 x 1690 (width*length*height) Weight : 1930kg Servo motor : feeding (1.2kw 1000rpm) Bending (1.2kw 1000rpm) Rotation (1.2kw 1000rpm) Bending capacity : soft wire (2.5~7.0) Hard wire (2.0~4.0)
