Pcb, cpu, copper scrap, nickel, tungsten.
PTFE Scraps.
Aluminum extrusion, scrap.
LAYER Double side FPCB + Partial PSR Application SENSOR Thickness CON. 0.2T L/S 125/125 LASER Drill 50 Copper plating Hole inner Min. 25 Inspection spec Not allowing damage on copper plating part SPECIAL item for controlling Stair-shape at Copper plating neighboring area Apply WET LAMINATION method
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
LAYER Double side FPCB + partial PSR + SUS + CBF Application CCM Thickness 0.3T L/S 60/60 DRILL/LAND 200/350 Copper plating Inner Hole Min. 18 Inspection spec Zero defect in SUS and appearance
LAYER 4Layer (FLEXIBLE 2L+RIGID 4L) 4-2-4-3-2 Application Blood Sugar Check Thickness 0.38T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.1mm Laser Drill BVH Min. 0.1mmSTACK VIA FILL copper plating Cu Plating INNER : VIA FILL / OUT : PTH Min.20+ VIA FILL L/S 50 / 50 (SPECIAL) PSR GREEN Surface treatment ENIG Stiffner PI (3Mil) Impedance 100
