Printed Circuit Board We specialise in Manufacturing and Exports of DRILL ENTRY AND BACK UP BOARDS DRILL ENTRY AND BACK UP BOARDS WE HAVE THREE TYPES OF DRILL ENTRY AND BACK UP MATERIAL PHENOLIC LAMINATED SHEETS ,BOTH SIDE GLOSS(BROWN COLOUR) MELAMINE LAMINATED SHEETS,BOTH SIDE GLOSS(BOTH SIDE WHITE COLOUR) Wood Core with Melamine Paper both sides. THICKNESS : 2.5MM THIS IS A GOOD BACK UP MATERIAL. Features: Used for PCB drilling Good surface flatness, good thickness tolerance Size: 42"X48" 54"X48" Thickness: 0.5mm, 0.8mm, FOR (ENTRY BOARD) THICKNESS: 1.2mm,1.5mm,2.0mm,2.5MM (BACK UP BOARD) ALLUMINUM ENTRY SHEET FOIL PAPER FOIL LAMINATE FEATURES USED FOR PCB DRILLING THICKNESS AS PER REQUIREMENT
FPC PCB flexible printed circuit board
All models of the H41q system family have all the components required for control tasks in a 19 inch subrack 5 units high with an integrated cable tray. â?? Depending on the system model, one or two central modules controlled by micro processors â?? Two interfaces RS485 on the central module for a transfer rate of up to 57600 bps â?? The central module generates a watchdog signal to switch off the testable output modules as the second way of switch off in the case of a fault â?? One or two power supply modules 24 V DC/5 V DC to generate the 5 V DC operating voltage for the central modules and the control voltage for the input/output modules
LAYER Double side FPCB + partial PSR + SUS + CBF Application CCM Thickness 0.3T L/S 60/60 DRILL/LAND 200/350 Copper plating Inner Hole Min. 18 Inspection spec Zero defect in SUS and appearance
LAYER Double side FPCB + Partial PSR Application SENSOR Thickness CON. 0.2T L/S 125/125 LASER Drill 50 Copper plating Hole inner Min. 25 Inspection spec Not allowing damage on copper plating part SPECIAL item for controlling Stair-shape at Copper plating neighboring area Apply WET LAMINATION method
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 LASER CUT tolerance +-50 Surface treatment SILVER Inspection spec Zero defect SPECIAL item for controlling Film coating and resolution Will apply scale for Laser individual recognition
Trends driving the car of the future are all enabled by more complex and intelligent electronics. Advanced driver-assistance systems (ADAS), human-machine interface (HMI), electrification, and increased vehicle to vehicle (V2V) and vehicle to infrastructure (V2I) connectivity rely on advanced electronics and sensing components. Electronics for automotive that must be produced at the highest quality levels, and quite literally, cannot fail.
JinSung Electronics prides itself on the ability to support all levels of flex interconnect technology requirements that are truly helping to save lives and improve quality of life. For JinSung's entire twenty-five years of flex interconnect fabrication service dedication to the field of medicine has been a key drive and focus. With innovation and collaboration with our customers, JinSung has produced flex and rigid-flex printed circuit boards that help to combine more functionality, ease of operation and smaller package size to doctors and health professionals.
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield. JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics. Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
The trend for Future automobiles enable with more complicated and Intelligent electronic devices. Advanced Driver Assistance Systems (ADAS), human-to-machine interface (HMI), electrification, and connection increases of V2V and V2I depend on the advanced electronic devices and detecting parts. Electronic devices for automobiles that should be produced under the best quality condition cannot be failed. 1. LAYER : 10 LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 2. Application : GPS 3. Thickness : 1.6T 4. Machine Drill : Min. 0.2 mm 5. Laser Drill : BVH Min. 0.1 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 100 micrometer / 100 micrometer
1. LAYER : 4 layer [FLEXIBLE 1 layer + RIGID 3 layer] 4-1 2. Application : Industrial Equipment 3. Thickness : 0.5T 4. Machine Drill : Min. 0.25 mm 5. Laser Drill : BVH Min. 0.12 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 110 micrometer/ 120 micrometer
Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market 1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6 2. Application : Inspection equipment of Semiconductor 3. Thickness : 0.5T 4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH 5. Machine Drill : Min. 0.25mm 6. Cu Plating : VIA FILL + PTH 7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
Unbalance Rigid Flexible (FPCB+FR4) Double Side manufacturing specification: 1. Layer : 2 layer [Flexible 1 layer + Rigid 1 layer] 2-1-2 2. Application : Industrial Equipment 3. Thickness : 1.6T 4. Machine drill : min. 0.25 mm 5. Cu plating : hole min. 20 micrometer 6. L/S : 400 micrometer / 100 micrometer 7. PSR / COV : blue / black 8. Surface treatment : ENIG 9. Impedence layer : 1 L
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics. Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield. JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
MOTOR manufacturing specification [FPCB MULTY] 1. Layer : FPCB 4 layer 2. Application : motor 3. Thickness : FPCB 0.1T / MULTY 0.3T 4. L/S : 50 micrometer/50 micrometer 5. Drill : LASER DRILL 0.08 mm 6. ANNULAR RING : 42.5 micrometer 7. SPECIAL item for controlling : Outer layer [14 layers ANNULAR RING ]
1. LAYER: FPCB S/S 2. Application: Medical equipment 3. Thickness : 0.06T 4. L/S: 50 micrometer /50 micrometer 5. DRILL/LAND: 200 micrometer /400 micrometer 6. Inspection spec: Zero defect on circuit 7. SPECIAL item for controlling :Stair-shape at inner circuit
Jinsung Electronics is a company to lead manufacturing of Flex Printed Circuits and Rigid-Flex Printed Circuits with fast delivery and competitive price. 1. LAYER : 4 layer (FLEXIBLE 2 layer+RIGID 2 layer) 4-2-4 2. application : Industrial Equipment 3. Thickness : 1.2T 4. Structure : 1-4L DRILL 5. Machine Drill : Min. 0.25 mm 6. Cu Plating : Min. 25 micrometer / NORMAL PALTING 7. L/S : 100 micrometer / 100 micrometer
