Board Thickness 0.07-0.40mm Base Material 0.5mil - 2mil Polyimide Copper Thickness 0.5OZ-2OZ Stiffener PI: 0.10-0.25UM, Fr4: 0.1-1.20MM, PET: 0.10-0.18MM, Metal:0.10-0.30MM Min. Line Width/ Spacing 3mil (0.08mm)/3mil (0.08mm) Coverlay Yellow, White, Black Silkscreen Color White, Black Surface Finishing ENIG, Flash Gold, Immersion Tin, OSP Min.Quantity of Order No MOQ Layer Count 1-6 Layer
Quick Details: 2W/m.k, Aluminum Core, 1L+Al+1L Base Material Aluminum Core Thermal conductivity 2W/m.k Layer Counts 1L+Al+1L Board Thickness 2.0 mm Copper Thickness 1OZ Min. Hole Size 12mil (0.3mm) Min. Line Width/ Spacing 4mil (0.1mm)/5mil (0.125mm) Solder mask Color White Silkscreen Color Black Surface Finishing Lead Free HASL Min.Quantity of Order No MOQ Certificate UL, ISO 9001, ISO 14001 Difficulty Aluminum Core
LAYER Double side FPCB + partial PSR + SUS + CBF Application CCM Thickness 0.3T L/S 60/60 DRILL/LAND 200/350 Copper plating Inner Hole Min. 18 Inspection spec Zero defect in SUS and appearance
LAYER Double side FPCB + Partial PSR Application SENSOR Thickness CON. 0.2T L/S 125/125 LASER Drill 50 Copper plating Hole inner Min. 25 Inspection spec Not allowing damage on copper plating part SPECIAL item for controlling Stair-shape at Copper plating neighboring area Apply WET LAMINATION method
LAYER FPCB S/S Application Medical equipment Thickness 0.06T L/S 50/50 LASER CUT tolerance +-50 Surface treatment SILVER Inspection spec Zero defect SPECIAL item for controlling Film coating and resolution Will apply scale for Laser individual recognition
Trends driving the car of the future are all enabled by more complex and intelligent electronics. Advanced driver-assistance systems (ADAS), human-machine interface (HMI), electrification, and increased vehicle to vehicle (V2V) and vehicle to infrastructure (V2I) connectivity rely on advanced electronics and sensing components. Electronics for automotive that must be produced at the highest quality levels, and quite literally, cannot fail.
JinSung Electronics prides itself on the ability to support all levels of flex interconnect technology requirements that are truly helping to save lives and improve quality of life. For JinSung's entire twenty-five years of flex interconnect fabrication service dedication to the field of medicine has been a key drive and focus. With innovation and collaboration with our customers, JinSung has produced flex and rigid-flex printed circuit boards that help to combine more functionality, ease of operation and smaller package size to doctors and health professionals.
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield. JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics. Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
The trend for Future automobiles enable with more complicated and Intelligent electronic devices. Advanced Driver Assistance Systems (ADAS), human-to-machine interface (HMI), electrification, and connection increases of V2V and V2I depend on the advanced electronic devices and detecting parts. Electronic devices for automobiles that should be produced under the best quality condition cannot be failed. 1. LAYER : 10 LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10 2. Application : GPS 3. Thickness : 1.6T 4. Machine Drill : Min. 0.2 mm 5. Laser Drill : BVH Min. 0.1 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 100 micrometer / 100 micrometer
1. LAYER : 4 layer [FLEXIBLE 1 layer + RIGID 3 layer] 4-1 2. Application : Industrial Equipment 3. Thickness : 0.5T 4. Machine Drill : Min. 0.25 mm 5. Laser Drill : BVH Min. 0.12 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 110 micrometer/ 120 micrometer
Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market 1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6 2. Application : Inspection equipment of Semiconductor 3. Thickness : 0.5T 4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH 5. Machine Drill : Min. 0.25mm 6. Cu Plating : VIA FILL + PTH 7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch
Button Cu Plating manufacturing specification [FPCB D/S] 1. Layer : Double side FPCB + Partial PSR 2. Application : Sensor 3. Thickness : CON. 0.2 T 4. L/S : 125 micrometer/125 micrometer 5. Laser drill : 50 micrometer 6. Copper plating : Hole inner Min. 25 micrometer 7.Inspection spec :Not allowing damage on copper plating part 8. SPECIAL item for controlling : - Stair-shape at Copper plating neighboring area - Apply WET LAMINATION method
Unbalance Rigid Flexible (FPCB+FR4) Double Side manufacturing specification: 1. Layer : 2 layer [Flexible 1 layer + Rigid 1 layer] 2-1-2 2. Application : Industrial Equipment 3. Thickness : 1.6T 4. Machine drill : min. 0.25 mm 5. Cu plating : hole min. 20 micrometer 6. L/S : 400 micrometer / 100 micrometer 7. PSR / COV : blue / black 8. Surface treatment : ENIG 9. Impedence layer : 1 L
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics. Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield. JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
MOTOR manufacturing specification [FPCB MULTY] 1. Layer : FPCB 4 layer 2. Application : motor 3. Thickness : FPCB 0.1T / MULTY 0.3T 4. L/S : 50 micrometer/50 micrometer 5. Drill : LASER DRILL 0.08 mm 6. ANNULAR RING : 42.5 micrometer 7. SPECIAL item for controlling : Outer layer [14 layers ANNULAR RING ]
1. LAYER: FPCB S/S 2. Application: Medical equipment 3. Thickness : 0.06T 4. L/S: 50 micrometer /50 micrometer 5. DRILL/LAND: 200 micrometer /400 micrometer 6. Inspection spec: Zero defect on circuit 7. SPECIAL item for controlling :Stair-shape at inner circuit
Jinsung Electronics is a company to lead manufacturing of Flex Printed Circuits and Rigid-Flex Printed Circuits with fast delivery and competitive price. 1. LAYER : 4 layer (FLEXIBLE 2 layer+RIGID 2 layer) 4-2-4 2. application : Industrial Equipment 3. Thickness : 1.2T 4. Structure : 1-4L DRILL 5. Machine Drill : Min. 0.25 mm 6. Cu Plating : Min. 25 micrometer / NORMAL PALTING 7. L/S : 100 micrometer / 100 micrometer
Devotions on the Flex interconnection services for medical area are the core driving force as well as the main focus of Jinsung Electronics over the last 25 years. Jinsung Electronics produced flex and rigid-flex printed circuit boards that assisted physicians and healthcare professionals to offer more functions, operational easiness, and smaller size packages through innovation and collaboration with customers 1. Layer : FPCB S/S 2. Application : Medical Equipment 3. Thickness : 0.06T 4. L/S : 50 micrometer/50 micrometer 5. Laser cut treatment : +-50 micrometer 6. Inspection spec. : No defect on circuit / No defect on Silver plating / not allow damage by Laser cut 7. Special item for controlling : 1. Film coating and resolution 2. Will apply Scale for Laser and individual recognition
