Thermally modified edged boards.
Electronic waste, panels like Winchester panel (HDD board), gold panel, RCK & backround panel, cards from servers or pc's, laptop panel, 1A panel (P1), 1B panel (P4), telecom server, server (dual slot), mobile boards high grade, mobile boards low grade, CD rom boards, LCD board, 2nd class (B1), 2nd class (B2), memory such as gold ram, silver ram, mobile phones, mobile phones (new with touch screen), connectors, ribbon wire, ribbon colour, HDD, empty boards, gold laminates, CD / DVD, power sup mix, 3th class, IC like IC plastic, ceramic, CPU like, 286, 386, 486 dx4, gold cap, ceramic CPU, CPU black plastic, CPU green plastic, pineless CPU, gold dats.
