Description
1. High purity (Sn99.99 Sn99.95 Sn99.90), excellent weldability, good infiltration.
2. Clean, beautiful. After welding, insulation, high resistance, low ionic contamination, PCB board welding residual minimal.
3. Good oxidation resistance, low tin slag and cost savings.
4. Solder joint is bright, full and uniform.
5. Economical and can produce the lowest consumption of the solid solder joints.
Application
Tin ingot is widely used as a coating material in High precision electronic Products, and other requirments of precision welding products, general electronics, food industry packaging, automotive and electrical industry, and hightemperature resistant products.
Raw melting material - aluminum scraps, cans, engine waste etc.
Output capacity - 5-30 tons/h, customized
Automation - Full automatic/ half automatic (based on output requirement and investment budget
Ingot type - ADC12 (7.5kg/ 10kg / customized)
1. After cleaning the oil and grease of waste aluminum, manually put it into the furnace with a forklift;
2. Ignition for melting furnace .Heat up to 680C, and input appropriate proportion of alloy elements. Heat up to 800C, melt and stir evenly, then fetch samples to the spectrometer for testing.
Every lot of production need to do testing .
3. Put A tool that attracts iron into the furnace by forklift, to suck away the iron in the aluminum water.
4. Put the slag agent into Alu liquid to remove the slag. After slag removed , put the slags into Aluminum ash separation machine , and let the aluminum water and ash separate. The proportion of slag agent and aluminum liquid is 1:500
5.Open the drain valve and the aluminum water flows automatically to the ingot production line After the ingot casting is completed, the ingot stacking robot will stack the ingots, which means the production is completed.
Metal tin is mainly used in the manufacture of alloys.
Tin and sulfur compounds - tin sulfide, which is similar in color to gold, is commonly used as a gold pigment.
Tin's modern application is as a solder for the electronics industry. Used in various purities and alloys (often with lead or indium), tin solders have a low melting point, which makes them suitable for bonding materials.
Standard
ASTM B29-03, BS EN 12659:1999, GB/T 469 -2005 ,
Content
Pb â?¥ 99.99 %
Density
11.34 g / cm 2
Color
Bluish
Weight
35 kgs / lump, 55 kgs / lump
Dimension
21" x 4" x 2.5"
Package
Standard Sea-worthy package, fixed by belt per ton
Shape
Rectangular Lump
Application
lead-acid storage batteries
Ammunition, cable sheathing, and building construction materials
counterweights, battery clamps
cast products such as: bearings, ballast, gaskets, type metal, terne plate, and foil
11,Mainly used for the preparation of â?¢ - V compound semiconductor InSb, Bi2Sb, GaSb, high purity alloys, electronic refrigeration element materials and germanium, silicon single crystal dopants.
(LME standards) Standard Cu Cathode-1, purity 99, 97-99, 99 %Dimension: 914 mm x 914 mm x 12 mm (LME standards)
Copper (Cu) min% 99.99%
Other materials may be present which are described below:
Oxygen O2 --
Sulfur S 4 PPM
Iron Fe 2 PPM
Silver(Argent 10 PPM
Lead Pb 0.2 PPM
Nickel Ni 0.2 PPM
Selenium Se 0.3 PPM
Antimony Sb 0.1 PPM
Silica Si 0.3 PPM
Cobalt Co 0.2 PPM
Arsenic As 0.1 PPM
Bismuth Bi 0.1 PPM
Manganese Mn 0.1 PPM
Tellurium Te 0.05 PPM
Aluminum Al 0.5 PPM
Magnesium Mg 0.4 PPM
Zinc Zn 0.4 PPM
(LME standards) Standard Cu Cathode-1, purity 99, 97-99, 99 %Dimension: 914 mm x 914 mm x 12 mm (LME standards)
Copper (Cu) min% 99.99%
Other materials may be present which are described below:
Oxygen O2 --
Sulfur S 4 PPM
Iron Fe 2 PPM
Silver(Argent 10 PPM
Lead Pb 0.2 PPM
Nickel Ni 0.2 PPM
Selenium Se 0.3 PPM
Antimony Sb 0.1 PPM
Silica Si 0.3 PPM
Cobalt Co 0.2 PPM
Arsenic As 0.1 PPM
Bismuth Bi 0.1 PPM
Manganese Mn 0.1 PPM
Tellurium Te 0.05 PPM
Aluminum Al 0.5 PPM
Magnesium Mg 0.4 PPM
Zinc Zn 0.4 PPM
