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PCB Spot Soldering MachineïCWDH-411Feature: 1.Heating rate could be adjustable for different products 2.Long life time thermode made of titanium alloy, ensure even temperature, fast raising 3.Thermode designed to be horizontal adjustment, ensure even component compression 4.Numerical control temperature, clear and precise 5.Has digital manometes, preset pressure range 6.Controlled by precise PID, phase-angle driving 7.Less vibration,less noise,voltage does not fluctuate 8.Welding head made of molybdenum alloys, good heat transfer coefficient, abrasion - resistant PCB Spot Soldering MachineïCWDH-411Specification: Size:815mmX600mmX880mm Operating Condition:10-60, 40%-95% Working size:380*380*80mm Welding Pressure:1-10KG Power:AC220V±10% 50HZ 2300W X axis moving range:X=380mm Y axis moving range:Y=380mm Z/R axis moving range:Z=80mm R=360° Repeatability precision(X/Y):±0.02mm Repeatability precision(Z):±0.02mm Repeatability precision(R):±0.05° Depression(Pa):4~5kg/cm2 Soler wire range:Φ 0.6mm~Φ 1.2mm Tem. setting:0-550 Tem. control precision:±1
Features: 1.Neat and smooth edge, no burr or overflow 2.More quick and easy, shorten the delivery time; 3. High quality ,no distortion,surface clean& uniformity; 4. Gathering the CNC tech,laser tech,software techâ?¦High accuracy,High speed Description: PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in break age. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods. Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate. Cutting Application: FPC and some relative materials; FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;
