Pressure range: -199-500Pa (-0.8-2.0 inch H2O, -20-50mm Aq)
Compact panel-mounted controller
High resolution of differential pressure
Excellent long-term stability
2 relay or 2 NPN-TR outputs
Analog signal output (4-20mA) configuration
RS485 communication (MODBUS/ASCII)
Shanghai TU-POLY Industrial Co.,Ltd is one of the leading thermostatic cartridge manfuacturers and suppliers in China, should you be interested in thermostatic cartridge 1300, please feel free to wholesale and buy products from our factory.
When you use Due as the controller of your 3D Printer, you may find the RAMPS1.4 is not compatible with DUE.As you know the Due is a microcontroller board based on the SAM3X8E Cortex-M3, the importance is the SAM3X8E chip used on the Due operates at 3.3V,worse applying 5V to the Due's inputs will likely damage the chip.
So we create a new RAMPS variant which is compatible with the Due to replace Ramps1.4.
Why should I use Ramps-FD instead of Ramps1.4
Campare Ramps-FD with Ramps1.4,the Improvements of Ramps-FD are below
* The RAMPS-FD has other hardware protection, through the jumper cap control motor drive IC
* The RAMPS-FD Much more than Ramps1.4 2-way PWM
* The RAMPS-FD has Larger driving power than Ramps1.4
* The RAMPS-FD 'POWER has two choices:12v and 24v
* CPU operates at 3.3V
* High-current IO pins are capable of 15 mA source, 9 mA sink
* Low-current IO pins capable of 3 mA source, 6 mA sink
* CPU package has an absolute max of 130mA
* The Due has 1 dedicated SPI port, and 4 multipurpose USART/SPI ports. The SPI port is only routed to the 6 pin header used for ICSP on Mega, but this is not used for ICSP on Due
* The Due does not have any EEPROM
* Due has lower power, computing faster and flash, sram bigger than mega2560
Quick Details
Place of Origin: Guangdong, China (Mainland)
Brand Name: cylconn
Model Number: 3.96mm pitch pin header
Type: Pin header
Application: PCB
Gender: Male
Connector type: pin header
PCB mounting type: DIP type connector
Material: Polyester, Ul94v-0
Terminal: Copper alloy
Finish: Flash gold/tin plated over nickel
Current rating: 7A
Insulation Resistance: 1000M Ohm,min
Dielectric voltage withstanding:1000V/minute
Contact resistance: 50m MAX
Operating temperature: -40? to -105?
Packaging & Delivery
Packaging Details: standard packing,by tray,ourside carton
Delivery Detail: 20days
Electrical connectors supplier wholesale good quality 3.96mm pin header
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Packaging Details: PE bags, Tape&Reel, Tray, PVC, Plastic Tube.
Delivery Detail: within 5~30 days, depends on order quantity
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OEM/ODM are available
100% tested before shipment
reliable performance
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1771-iad the allen-bradley / rockwell automation 1771-iad is a general-purpose 120v ac/dc input. Operating voltage for 1771iad is 79...138v ac and 79...138v dc
Best price+one year warranty+in stock+new+original
1771-iad the allen-bradley / rockwell automation 1771-iad is a general-purpose 120v ac/dc input. Operating voltage for 1771iad is 79...138v ac and 79...138v dc
1771-ir the allen-bradley / rockwell automation 1771-ir rtd input module houses 6 rtd inputs (three-wire). Voltage range of 1771ir is 100 platinum and 10 copper
Best price+one year warranty+in stock+new+original
1771-ir the allen-bradley / rockwell automation 1771-ir rtd input module houses 6 rtd inputs (three-wire). Voltage range of 1771ir is 100 platinum and 10 copper
Although the Intel EP80579 branding will be new to most of you, the underlying technology is comprised of products that have a well established history at Intel. In fact, this line of products is based on the Pentium M processor core, as it has been in development for quite some time now. The Intel EP80579 Integrated Processor family, however, is more than just a new processor. The products actually consist of new System on a Chip designs that integrate a Pentium M core, with a Memory Controller Hub (MCH), I/O hub (ICH), and in some cases specialized security, TDM (Time Division Multiplexing for voice-over-IP apps), and data path acceleration engines, which have been dubbed Intel QuickAssist Technology.
Development was started on the Intel EP80579 Integrated Processor family to prepare the company for the impending onslaught of smart, Internet-connected devices and appliances predicted to arrive over the next few years. The Intel EP80579 product line puts Intel in a position to target several growth areas across Consumer Electronics (CE), Mobile Internet Devices (MIDs) and other embedded markets. "We’re now able to deliver more highly integrated products ranging from industrial robotics and in-car infotainment systems to set-top boxes, MIDs and other devices. By designing more complex systems onto smaller chips, Intel will scale the performance, functionality and software compatibility of IA while controlling the overall power, cost and size requirements to better meet respective market needs,” said Gadi Singer.
The individual components within the Intel EP80579 SoCs communicate over an internal Front Side Bus that connects the Processor Core, MCH, and ICH. And Intel has also developed a high performance bus to connect the security, TDM, and data path acceleration engines to the I/O Complex. Please note, that only four of the initial eight products being announced today feature the Acceleration Services Unit and TDM interface represented in the block diagram above. Those features are what make up the Intel QuickAssist Technology, which isn't featured on every Intel EP80579 SoC.
Hope this article could give you a little help.
