Key Features * M-DISC Support * Silent Play * Win 10 Compatible * 24x Writing Speed Tech Specs * Max Speed - DVD 24x DVD+/-R Write 8x DVD+/-R DL Write 5x DVD-RAM Write CD 48x CD-R Write * Host interface - SATA (Serial ATA) * Dimentions (W x H x D) - 146 mm x 41.3 mm x 165 mm (Without Bazel) * Net Weight - 610g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * M-DISC Support * Silent Play * Win 10 Compatible * 24x Writing Speed Tech Specs * Max Speed - DVD 24x DVD+/-R Write 8x DVD+/-R DL Write 5x DVD-RAM Write CD 48x CD-R Write * Host interface - SATA (Serial ATA) * Dimentions (W x H x D) - 146 mm x 41.3 mm x 165 mm (Without Bazel) * Net Weight - 610g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * Silent Play * Win 10 Compatible Tech Specs Max Speed - DVD 18x DVD-ROM Read 16x DVD+/-R Read 12x DVD+/-R DL Read 5x DVD-RAM Read CD 48x CD-ROM Read 48x CD-R Read * Host interface - SATA (Serial ATA) * Dimentions (W x H x D) - 146 mm x 41.3 mm x 165 mm (Without Bazel) * Net Weight - 610g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * Silent Play * Win 10 Compatible Tech Specs * Max Speed DVD 16x DVD-ROM Read 16x DVD+/-R Read 12x DVD+/-R DL Read 5x DVD-RAM Read CD 48x CD-ROM Read 48x CD-R Read Host interface SATA (Serial ATA) * Dimentions (W x H x D) - 146 mm x 41.3 mm x 165 mm (Without Bazel) * Net Weight - 610g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * Silent Play * Win 10 Compatible Tech Specs * Max Speed - DVD 8x DVD-ROM Read 8x DVD+/-R Read 8x DVD+/-R DL Read 5x DVD-RAM Read CD 24x CD-ROM Read 24x CD-R Read * Host interface - SATA (Serial ATA) * Dimentions (W x H x D) - 128mm x 12.7mm x 127mm (without Bezel) * Net Weight - 150g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * Android Connectivity * TV Connectivity * M-DISC Support * Silent Play * Super Multi Compatibility * Win 10 & MAC OS Compatible * 8x Writing Speed * Slimmer to Slimmest * Lighter to Lightest Tech Specs * Max Speed - DVD 8x DVD+/-R Write 6x DVD+/-R DL Write 5x DVD-RAM Write CD 24x CD-R Write * Host interface - USB 2.0 (3.0 compatible) * Dimentions (W x H x D) - 141 mm x 14 mm x 136.5 mm * Net Weight - 200 g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * Blu-ray Disc Support * BDXL Support * M-DISC Support * Silent Play * Win 10 Compatible Tech Specs * Max Speed UHD Blu-ray 6x UHD BD-ROM Read BD 6x BD-R Write 6x BD-R DL Write BDXL 4x BD-R TL Write 4x BD-R QL Write DVD 8x DVD+/-R Write 6x DVD+/-R DL Write 5x DVD-RAM Write CD 24x CD-R Write * Host interface - SATA (Serial ATA) * Dimentions (W x H x D) - 128mm x 9.5mm x 127mm (Without Bezel) * Net Weight - 129g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * TV Connectivity * M-DISC Support * Silent Play * Super Multi Compatibility * Win 10 & MAC OS Compatible * 8x Writing Speed * Slimmer to Slimmest * Lighter to Lightest Tech Specs * Max Speed - DVD 8x DVD+/-R Write 6x DVD+/-R DL Write 5x DVD-RAM Write CD 24x CD-R Write * Host interface - USB 2.0 (3.0 compatible) * Dimentions (W x H x D) - 141 mm x 14 mm x 136.5 mm * Net Weight - 200 g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * TV Connectivity * M-DISC Support * Silent Play * Super Multi Compatibility * Win 10 & MAC OS Compatible * 8x Writing Speed * Slimmer to Slimmest * Lighter to Lightest Tech Specs * Max Speed - DVD 8x DVD+/-R Write 6x DVD+/-R DL Write 5x DVD-RAM Write CD 24x CD-R Write * Host interface - USB 2.0 (3.0 compatible) * Dimentions (W x H x D) - 141 mm x 14 mm x 136.5 mm * Net Weight - 200 g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * TV Connectivity * M-DISC Support * Silent Play * Super Multi Compatibility * Win 10 & MAC OS Compatible * 8x Writing Speed * Slimmer to Slimmest * Lighter to Lightest Tech Specs * Max Speed - DVD 8x DVD+/-R Write 6x DVD+/-R DL Write 5x DVD-RAM Write CD 24x CD-R Write * Host interface - USB 2.0 (3.0 compatible) * Dimentions (W x H x D) - 141 mm x 14 mm x 136.5 mm * Net Weight - 200 g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * TV Connectivity * M-DISC Support * Silent Play * Super Multi Compatibility * Win 10 & MAC OS Compatible * 8x Writing Speed * Slimmer to Slimmest * Lighter to Lightest Tech Specs * Max Speed - DVD 8x DVD+/-R Write 6x DVD+/-R DL Write 5x DVD-RAM Write CD 24x CD-R Write * Host interface - USB 2.0 (3.0 compatible) * Dimentions (W x H x D) - 141 mm x 14 mm x 136.5 mm * Net Weight - 200 g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Key Features * Slot-in Design * TV Connectivity * M-DISC Support * Silent Play * Super Multi Compatibility * Win 10 & MAC OS Compatible * 8x Writing Speed Tech Specs * Max Speed - DVD 8x DVD+/-R Write 6x DVD+/-R DL Write 5x DVD-RAM Write CD 24x CD-R Write * Host interface - USB 2.0 (3.0 compatible) * Dimentions (W x H x D) - 145.5mm x 15mm x 136 mm * Net Weight - 240 g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours
Key Features * TV Connectivity * M-DISC Support * Silent Play * Super Multi Compatibility * Win 10 & MAC OS Compatible * 8x Writing Speed * Lighter to Lightest Tech Specs * Max Speed - DVD 8x DVD+/-R Write 6x DVD+/-R DL Write 5x DVD-RAM Write CD 24x CD-R Write * Host interface - USB 2.0 (3.0 compatible) * Dimentions (W x H x D) - 144mm x 17.5mm x 135.5mm * Net Weight - 200 g * MTTF(Mean Time To Failure) - 60,000 POH (Power On Hours)
Electronics, mobile phones.
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.