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We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group

3 in 1 Digital Camera, Take it with you everywhere PC Camera, Digital Camera, Digital Camcorder

we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing

POM regrind black color full container available POM plastic possesses the same priority features as other plastic polymers, some of the highlights of the special resin: High hardness Bearing good Low friction number High resistance to abrasion High temperature resistant Less water intake Has anti-static ability Dimensional stability, little change Less smoke burns when burning High glossy surface High crystallization In addition to the priority points, POM plastic also has some limited formats such as: Quality acid resistance and alkali High hatch rate when changing secretions Operation mode Heat range MATERIAL: POM regrind black color full container available CATEGORY: POM TYPE: Regrind GRADE: Black color SPECIFICATION: 1 full container available Origin: Tunisia LOADING WEIGHT: 23 Ton FOB (USD/Ton): 650$ - 850$ Packaging: Jumbo Bag Est. Shipping Time: 15, 30, 45 days

The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.