Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Advantage of high quality High efficiency P Type polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
