Lms-STF series heat pressed silicon rubber sheet Product features: 1.Extremely high heat transfer, heat resistance and buffer. 2. Not to FPC, Glass and other damage. 3. The heat has super stable characteristics and the pressure on the product consistency. 4. High resilience and non-stick. 5. Antistatic, no powder on the surface. Product specifications: 1, (thick:0.2mm--0.45mm) * (width:8mm-600mm) * (length:5-30m). 2, special specifications can be customized according to customer demand, and provide our customers customized various specifications of the iceberg. 3, the products are divided into common type SG (gray) and anti-static SGB (black). 4, the product is commonly used inside diameter 32mm, 38mm, can be customized according to customer demand. Product application: COG/FOG hot pressing bonding process for various display screens, ACF conductive film hot pressing, etc.. Product application: application of various display COG\FOG hot state fixed process, or for transistor, IC and other electronic semiconductor products for insulation material, heat dissipation material use, or application in electric regulator and a temperature sensor, the advance on the bottom surface of the hot pressing head, the conduction temperature more uniform, the isolation is pressing products and head, and can prevent electrostatic isolation protection role. Specifications: Thickness:0.2mm~0.45mm Width:8mm~600mm Length:5m~30m Sizeï¼?Customer Size Accepted Packaging Details:As customer requried Color:Grey andBlack Hardness(Shore A):75~80 Surfaceï¼?Matte Use Temperature(â??)ï¼?-60~320 Volume Independence(Ω.cm)ï¼?10^8--10^12 Thermal Conductivity(w/mk):0.5~0.73 Elongation(%):165~180 Tensile Strength(Mpa):6.0~7.3 Compression(Max%):26~30
