Available specifications: Base materials: FR4, aluminum, FPC and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry Possible soldermask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1,000mm Hole diameter: 0.2mm (minimum) Line width: 0.075mm (minimum) Line spacing: 0.075mm (minimum) SMT pitch: 30¡ã (minimum) Annular ring: 0.05mm (minimum) Aspect ratio: 11:01 Surface/hole plating tolerance: Hole tolerance (PTH): 0.25mm Hole tolerance (NPTH): 0.15mm SM tolerance (LPI): Dimension Electrically test: supported RoHS Directive-compliant Possibility of SMT device mounting: supported Product-level Certifications: SGS:12024915-G2 ROHS:SP10-003347-SH UL:E302512-080423 SGS:12409491-GZ
