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Layer:2
Finished Board Thickness:1.6mm
Material:FR-4
Min. Drilled Hole Size:3 mil(0.075mm)
Min. Line Width 3 mil(0.075mm)
Min. Line Spacing:3 mil(0.075mm)
Surface Finish:Plating/Immersion Gold
Copper Thickness:10.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz OZ
Solder Mask Color:Blue/Red/Green
Copper Thickness in Hole:>25.0um (>1mil)
Inner Packing:Vacuum Packing/Plastic Bag
Outer Packing:Standard Carton Packing
Shape Tolerance:+/-0.13
Hole Tolerance PTH: +/-0.076 NPTH:+/-0.05
Certificate:UL/ISO 9001, ISO14000, SGS, ROHS
Special Requirements:Buried and blind vias + controlled impedance BGA
Profiling:Routing, V-CUT, Beveling