Layer:2 Finished Board Thickness:1.6mm Material:FR-4 Min. Drilled Hole Size:3 mil(0.075mm) Min. Line Width 3 mil(0.075mm) Min. Line Spacing:3 mil(0.075mm) Surface Finish:Plating/Immersion Gold Copper Thickness:10.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz OZ Solder Mask Color:Blue/Red/Green Copper Thickness in Hole:>25.0um (>1mil) Inner Packing:Vacuum Packing/Plastic Bag Outer Packing:Standard Carton Packing Shape Tolerance:+/-0.13 Hole Tolerance PTH: +/-0.076 NPTH:+/-0.05 Certificate:UL/ISO 9001, ISO14000, SGS, ROHS Special Requirements:Buried and blind vias + controlled impedance BGA Profiling:Routing, V-CUT, Beveling
