Metallized YIG Microwave ferrite substrate Technical requirements: 1- The Ferrite Thickness should be 0.37mm. In the process of ferrite production, fine grinding method should be used. The surface of the ferrite should be polished (To reduce the roughness). Material:CY1780 2- Use a soft gold coating. Clad layer: Cu1m4mAu2.5m5.7m. The plating thickness should be 8~10m(Red area ). 3- The bottom side will be attached to a Gold plated carrier by soldering. The solder paste model can be Pb63Sn37. The carrier material is Iron. Clad layer: Cu36mNi14m Au12m. The final carrier dimensions (after plating) are 12mm X 9mm X 0.5mm. 4- The resistive layer should be 75 Ohm/Sq. The final resistor should be 50 Ohm (+/-10% tolerance) (Green area)
