Polyamide For Hot Melt KINGMIDE H-175SP is a high molecular weight polyamide resin especially designed for hot melt-adhesive use. KINGMIDE H-175SP is easy to soluble in mixed organic solvent, such as toluene and alcohol type solvent. This resin has the characteristics of high softening point, and high molten viscosity so that it is suitable for applications where high heat resistance and high adhesive strength and good toughness. Viscosity (mPa s / 232C) 3,000 ~ 6,000.
