A960 Alumina offers consistently reliable and convincing performance even when subject to high thermal and electrical loads in terms of its: Thermocycling capability, Thermal shock resistance, Flexural strength, Surface quality, Thermal conductivity. This makes A960 Alumina Ceramic Substrates ideal for power electronics in conjunction with direct copper bonding (DCB) and active metal brazing (AMB). ALN Aluminum Nitride - with outstanding insulating properties and extremely high thermal conductivity (â?¥ 170 W/mK), Aluminum Nitride is perfect for the extremely high performance required in the electronics industry. AlN ceramic enables the compact, affordable construction of components and hybrid designs with high integration density. Extraordinary mechanical strength and a low thermal expansion coefficient enable seamless system integration.
