DBC substrate are composed of a ceramic
insulator,Al2O3 or AIN onto which pure copper
metal is attached by a high temperature eutectic
melting process and thus tightly and firmly joined to the ceramic,
DBC substrates have high
thermal conductivity,excellent electrical
insulation,excellent current carrying capability,
and good mechanical strength,and the thermal
expansion coefficient is close to that of silicon
etc.As a new and high capability substrate.DBC
substrates have been used widely in electric
power and electronic industry.