The material is heat reinforced polymer, designed to meet the Thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sinks performance benefits a lot from the low heat resistance. And improve the microprocessor, DC - DC converter of memory module and the reliability of power module. The phase change characteristics: the material is solid in room temperature and installation is completely convenient, used between heatsink and devices. The material can be softened and flowing when the products reach phase-change temperature to fill the devices tiny irregular contact surface. Thus, the material has the ability to fill the gap between the devices and heat sink completely, make the phase change better than non-current elastomers or thermal graphite pad and get the performance of thermal conductive silicon grease. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material cannot Features & Benefits: Low heat resistance and low stress Natural sticky, easy to use-no need to use glue No radiator preheating Flow but not silicon oil Low volatility--less than 1%
