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New Wds-580 Manual Motherboard Repair Machine

Supplier From China
Nov-15-17

WDS-580 BGA Rework Station Technology Parameter:

Total Power :4800W
Upper Heating Power:800W
Lower Heating Power:1200W
Infrared Heating Power:2700W1200W is controlled
Power supply:(Single Phase) AC 220V±10 50Hz
Location way :V-shape card slot + Universal jigs
Temperature Controlling:K-type thermocouple closed loop control, independent temperature
control, precision up to ±3 degree
Electrical Material :Touch screen + Temperature control module + PLC control
Max PCB size :400370mm
Min PCB size:1010mm
Sensor :1 unit
PCB Thickness :0.3-5mm
Suitable Chip Size :2*2mm-60*60mm
Machine Size :500Ã?590Ã?650mm
Weight Net :40kg

WDS-580 BGA Rework station Feature :
1.Adopted with Linear slider, so all the three axles (X, Y, and Z) can do fine tuning and quick orientation with perfect positioning accuracy and speedily maneuverability.

2.Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen.

3.Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±3â??.The upper temperature zone can be moved freely according to needs, the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.

4.The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly.

5.High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.

6.Large power fan to cool down the PCB quickly. The built-in vacuum pump and external vacuum nozzle is able to take BGA chips out easily.

7.Having alarm prompt function after welding is done, specially added early warning function for convenient operation.

8. It has Passed CE certificate. It is equipped with emergency stop switch and protection equipment to power off automatically when abnormal accident happened. Under this situation that temperature is out of control, circuit can automatically cut off the power with double over temperature protection function.


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The price would change slightly sometimes, please email or call us for more details.
All products sold by us can unconditional return within 7 days after signing off and one month guarantee. exclude damage due to human errors).

Notice:
Please note: returned goods to ensure that the integrity of the non-repudiation, the return and repair of freight by the customer commitment. If there's urgent order or pointed express delivery, please let us to be notified later. Please order after confirm. Thanks for your support.
VERIFIED
Jul-29-22
 
CPU: Support 4th/5th Gen intel core CPUs (LGA1150)

Chipset: Intel H81 Express Chipset.

Memory: 2*240-pin DDR3 SDRAM Slots, Memory up to 16GB, Supports dual channel DDR3 1066/1333/1600/1866MHZ.

I/O interface: 1 x PS/2 keyboard port, 1 x PS/2 mouse port, 2 x USB, compatible with USB 2.0 for H81-G335-P, 4 x USB, compatible with USB 2.0 for H81-G335-U, 2 x USB, compatible with USB 3.0, 1 x VGA port, 1 x HDMI port, 1 x RJ45 port, 1 x 3-in-1 Audio port.

Onboard Interface: 1 x 24-pin ATX Connector, 1 x 4-pin ATX 12V power connector, 2 x USB Connector, can support 2 x USB 2.0, 1 x F_AUDIO Connector, 1 x F_PANEL Connector, 1 x SPEAKER Connector, 1 x FAN Connector, 2 x Serial SATA/6GB/S Connector port, 2 x Serial SATA/3GB/S Connector port, 1 x LPC DEBUG connector.

Integrated Sound: With 6-channel HD Audio Codec onboard, Provides front audio interface; provides front stereo mic interface.

Integrated LAN: With 10/100 Mbps LAN onboard

Expansion Slot: 1 x PCI Express x 16 slots, 1 x 120-pin PCI slot

Dimension: Micro-ATX architecture (17 x 19 cm)
VERIFIED
Jul-29-22
 
CPU: Support I3/I5/I7 series CPU (LGA1155)

Chipset: Intel H61 Express Chipset

Memory: 2*240-pin DDR3 SDRAM Slots, Memory up to 16GB, Supports dual channel DDR3 1066/1333/1600MHZ

I/O interface: 1 x PS/2 keyboard port, 1 x PS/2 mouse port, 4 x USB, compatible with USB 2.0 for H61-303-P, 6 x USB, compatible with USB 2.0 for H61-303-U, 1 x VGA port, 1 x HDMI port, 1 x RJ45 port, 1 x 3-in-1 Audio port

Onboard Interface: 1 x 24-pin ATX Connector, 1 x 4-pin ATX 12V power connector, 2 x USB Connector, can support 4 x USB 2.0, 1 x F_AUDIO Connector, 1 x F_PANEL Connector, 1 x SPEAKER Connector, 1 x FAN Connector, 4 x Serial SATA Connector port, 1 x LPC�¬_ DEBUG connector.

Integrated Sound: With 6-channel HD Audio Codec onboard, Provides front audio interface; provides front stereo mic interface.

Integrated LAN: With 10/100 Mbps LAN onboard

Expansion Slot: 1 x PCI Express x 16 slots, 1 x 120-pin PCI slot

Dimension: Micro-ATX architecture (17 x 19 cm)

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