Uv laser marking machine
TypeKu1table, ku2 universal, ku3 rotary table
Laser type/wavelength 355nm
Laser power 1.5w3w5w10w
Beam quality m2<1.5
Pulse width 4-200ns
Frequency 20khz ~ 100khz
Pulse repetition frequency 100khz
Power stability >4h+/-3% rms
Peak power 125|¨¬j/10kw
Marking size 100mm x 100mm
180mm x 180mm or order
Marking depth Adjustable
Marking speed 15000mm/s
Marking width min 0.01mm(10|¨¬m)
Marking character min 0.1mm
Power total 700w
Working temp. 10 - 30
Power supply Ac 220v/50hz
Outsize 570*840*1240mm(difference by types)
Advantages:
1.Fully air cooling system;
2.Stable performance, low maintenance in 100, 000hours;
3.All kinds of metal materials and some non-metallic material marking, can be used for the depth of the moment, the applicability is very widely;
4.Control by computer, can freely change the marking and parameters;
5.Small laser spot, fine, unique and never wear marking effect.
Applications:
1.Areas with depth, smoothness and fine requirements;
2.Mobile phone keypad, plastic translucent keypad;
3.Electronic components, integrated circuits (ic), pcb;
4.Electrical appliances, communication products, signs;
5.Sanitary ware, hardware products;
6.Tool accessories, precision instruments panels;
7.Pvc pipe, medical equipment.
Wooden boxes
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
UV Laser Marking Machine Type: FST-3w/5w/8w Power: 3w/5w/8w Laser wavelength: 355 Marking area: 150mm*150mm Power input: 220V / 50HZ / single phase or 110V / 60HZ / single phase Power requirement:
TETE Laser equipments are widely used for laser marking, laser welding and laser cutting in various industries. Kinds of laser series meet different processing requirements. Features In a strict pursuit of exquisiteness, we offer an unrivaled technical quality With advanced technical assurance, no frequency doubling crystal needs to be replaced, which can indeed reduce the cost New UV-Laser adopts simplified optical design which improve its reliability Fully enclosed design which highly enhances it's safety New design and selective components can guarantee a long life time
Uv laser marking machine TypeKu1table, ku2 universal, ku3 rotary table Laser type/wavelength 355nm Laser power 1.5w3w5w10w Beam quality m24h+/-3% rms Peak power 125|¨¬j/10kw Marking size 100mm x 100mm 180mm x 180mm or order Marking depth Adjustable Marking speed 15000mm/s Marking width min 0.01mm(10|¨¬m) Marking character min 0.1mm Power total 700w Working temp. 10 - 30 Power supply Ac 220v/50hz Outsize 570*840*1240mm(difference by types) Advantages: 1.Fully air cooling system; 2.Stable performance, low maintenance in 100, 000hours; 3.All kinds of metal materials and some non-metallic material marking, can be used for the depth of the moment, the applicability is very widely; 4.Control by computer, can freely change the marking and parameters; 5.Small laser spot, fine, unique and never wear marking effect. Applications: 1.Areas with depth, smoothness and fine requirements; 2.Mobile phone keypad, plastic translucent keypad; 3.Electronic components, integrated circuits (ic), pcb; 4.Electrical appliances, communication products, signs; 5.Sanitary ware, hardware products; 6.Tool accessories, precision instruments panels; 7.Pvc pipe, medical equipment. Wooden boxes
Description- The UV Laser Marking with its wavelength 355nm is suitable for marking plastics (ABS, PA) due to a high repetition rate. The UV laser wavelength is suitable and versatile in marking a wide range of materials and is perfect for â??cold markingâ?? applications where heat zones are not allowed. UV Laser mark at very high speeds which are indispensable for short cycle times in industrial manufacturing environments. With high peak powers they are most suitable for fine marking and structuring without thermal impact on glass applications and/or ceramics. The UV laser marking will mark plastics and silicon materials without the need of additives and will also mark glass with drastically reduced risk of micro fracture. The excellent beam quality also affords this laser the ability to be utilized in micro marking applications such as electronics, circuit boards and microchips in addition to solar panels and precise medical marking applications. They also provide an excellent quality for classical laser marking applications and micro material processing. Features- Small beam diameter and fine marking line Good quality and high laser beam stability Complete machine stability, simple and easy operation Narrow pulse width, small heat affected zone, work-piece without damage Suitable for sensitive material as cold light source Laser directly acting on molecular chain with maximum extend to avoid thermal effect It works stably, applied in superbly precise marking, such as: LCD, wafer, chip ceramic, sapphire, precise surface marking of other materials,3C electronics, Lamps, food package, wire rod ,leather, ceramic, PCV, glass, Phone case, medicine bottle, fine marking on glass substrate, electric appliance marking and so on. Technical Specifications- Wavelength 335nm Laser Beam Mode TEM00 Average Power Up to 2W Positioning Visible Red Diode Light Input Power 115/230VAC 50/60Hz System Power Consumption < 950W Cooling Air Cooled, active thermo-electric/Water Cooled Operating Temperature Range 18 to 35C (64 to 95F) Humidity 10% to 85% Non-condensing STANDARD LENS CONFIGURATIONS FOCAL LENGTH 100 mm 65 mm X 65 mm (2.56 X 2.56) 160 mm 110 mm X 110 mm (4.33 X 4.33) 255 mm 175 mm X 175 mm (6.89 X 6.89)
Uv laser marking machine suitable for sapphire, quartz, ceramics, glass and other superhard materials, exquisite marking. Suitable for mobile phones, ipad industry related accessories marking, such as mobile phone cover, touch screen, data cable, power supply, connectors, etc. Widely used in food, medicine, cosmetics, wire and other polymer materials, the surface of the bottle marking, bore microporous.
Condition:New Cooling Mode: Water Cooling Control Software:EZCAD Software Graphic Format Supported:AI, DXF Working Accuracy:0.01mm Place of Origin:Shandong, China (Mainland) Brand Name:Hanten laser Model Number:HTU-3/5 Power(W):3W /5W Certification:CCC, CE, SGS, FDA After-sales Service Provided:Engineers available to service machinery overseas Laser source:RFH/Coherent/Huaray Marking Depth:0.01-5mm (according to different material ) laser wavelength:355nm Marking speed:
Model No. CY-ZW3W Output Power 3W / 5W /10W Marking area 110mm x 110mm ( Optional) Marking Speed