Indium plate,Indium target ,Indium, Sputtering Targets
We can also supply Indium bar, Indium wire, Indium foil, Indium ball, Indium granules,Indium powder, Indium Trioxide, Indium Nitrate, Indium Trichloride, Indium Hydroxide, etc.
Our products and services are as below:
1, Accurate and Short delivery time,Accurate and Short lead times enable you to get your order in time to meet your production schedule, Indium Plate delivery time:Usualy 5-7days
2,Stable quality
Indium Plate
Purity:99.995%.
Dimensional tolerances:+/-0.1mm
Surface finish:Ra 0.8
According to customers size requirements,for example: Indium Plate 587.6x94.8x12mmT,598.5*127*6mm etc.
3 Safe Packing
Platic bag,vacuum packaging inside
Outer 1.2cm plywood box more safe.
Platic bag,vacuum packaging inside
Outer 1.2cm plywood box more safe.
Metal tin is mainly used in the manufacture of alloys.
Tin and sulfur compounds - tin sulfide, which is similar in color to gold, is commonly used as a gold pigment.
Tin's modern application is as a solder for the electronics industry. Used in various purities and alloys (often with lead or indium), tin solders have a low melting point, which makes them suitable for bonding materials.
Standard
ASTM B29-03, BS EN 12659:1999, GB/T 469 -2005 ,
Content
Pb â?¥ 99.99 %
Density
11.34 g / cm 2
Color
Bluish
Weight
35 kgs / lump, 55 kgs / lump
Dimension
21" x 4" x 2.5"
Package
Standard Sea-worthy package, fixed by belt per ton
Shape
Rectangular Lump
Application
lead-acid storage batteries
Ammunition, cable sheathing, and building construction materials
counterweights, battery clamps
cast products such as: bearings, ballast, gaskets, type metal, terne plate, and foil
Indium sulfate in2(so4)3
Our company can supply a series of indium sulfate products.
It can be manufactured according to the requirements of customers with different crystal water, such as in2(so4)3·9h2o in2o12s3 or in2(so4)3
Ppearance: white crystalline powder
Characteristic: deliquescent and easily dissolves in water.
Package: it is packed in a white plastic bottle inner with vacuum polyethylene bag.
Application: it is mainly used for liquid of plating indium
Cas: 13464-82-9
Hengxing 0.1mm 0.12mm Brass Coated Solar Wafer Cutting Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
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Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsahttp://en.hengxingchinese.com/
Solar Wafer Cutting wire Silicon Cutting Sawing Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity
Solar Wafer Cutting wire Silicon Cutting Sawing Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
Solar Wafer Cutting wire Silicon Cutting Sawing Wire
Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon.
It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc.
(1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw.
(2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity.
(3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well.
(4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few.
( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
