Indium plate,Indium target ,Indium, Sputtering Targets
We can also supply Indium bar, Indium wire, Indium foil, Indium ball, Indium granules,Indium powder, Indium Trioxide, Indium Nitrate, Indium Trichloride, Indium Hydroxide, etc.
Our products and services are as below:
1, Accurate and Short delivery time,Accurate and Short lead times enable you to get your order in time to meet your production schedule, Indium Plate delivery time:Usualy 5-7days
2,Stable quality
Indium Plate
Purity:99.995%.
Dimensional tolerances:+/-0.1mm
Surface finish:Ra 0.8
According to customers size requirements,for example: Indium Plate 587.6x94.8x12mmT,598.5*127*6mm etc.
3 Safe Packing
Platic bag,vacuum packaging inside
Outer 1.2cm plywood box more safe.
Platic bag,vacuum packaging inside
Outer 1.2cm plywood box more safe.
Metal tin is mainly used in the manufacture of alloys. Tin and sulfur compounds - tin sulfide, which is similar in color to gold, is commonly used as a gold pigment. Tin's modern application is as a solder for the electronics industry. Used in various purities and alloys (often with lead or indium), tin solders have a low melting point, which makes them suitable for bonding materials. Standard ASTM B29-03, BS EN 12659:1999, GB/T 469 -2005 , Content Pb â?¥ 99.99 % Density 11.34 g / cm 2 Color Bluish Weight 35 kgs / lump, 55 kgs / lump Dimension 21" x 4" x 2.5" Package Standard Sea-worthy package, fixed by belt per ton Shape Rectangular Lump Application lead-acid storage batteries Ammunition, cable sheathing, and building construction materials counterweights, battery clamps cast products such as: bearings, ballast, gaskets, type metal, terne plate, and foil Container Size 20Gp - 2.352(width) *2.385 ( Height ) * 5.90 ( Inside length ) Meter 40Gp - 2.352(width) *2.385 ( Height ) * 11.8 ( Inside length ) Meter 40HQ - 2.352(width) *2.69 ( Width ) * 5.90 ( Inside length ) Meter
Supplier: Indium ingot, indium wire, indium foil, indium sheet, indium ring, indium disk, indium plate, indium target, indium strip, indium slag, gallium metal, vanadium metal, germanium ingot and other metal products.
Indium sulfate in2(so4)3 Our company can supply a series of indium sulfate products. It can be manufactured according to the requirements of customers with different crystal water, such as in2(so4)3·9h2o in2o12s3 or in2(so4)3 Ppearance: white crystalline powder Characteristic: deliquescent and easily dissolves in water. Package: it is packed in a white plastic bottle inner with vacuum polyethylene bag. Application: it is mainly used for liquid of plating indium Cas: 13464-82-9
Supplier: Tungsten filament, aluminum wire, plate,, electro plate painting, toner, chrome wire, indium wire, vacuum gauge, vacuum pump oil, diffusion pump oil, vacuum mud, vacuum grease, paint thinner and other vacuum metalizing related products
Evaporation material Purity: 99%-99.999% Shape:(1-3mm, 3-5mm) piece,wire(0.1-5mm),pellet,Sheet, slug, Powder, customer made Application:optical thin film, electric thin film, superconducting thin film, protective film. 1.Evaporation Material Specafication(need know more, Please click http://www.china-raremetal.com/evaporation_material.htm) Purity: 99%-99.999% Shape:(1-3mm, 3-5mm) piece,wire(0.1-5mm),pellet,Sheet, slug, Powder, customer made Application:optical thin film, electric thin film, superconducting thin film, protective film. 1.1 Metal Evaporation Materials Aliumium (Al),Indium (In), Plumbum (Pb), Platinum (Pt),Magnesium (Mg), Molybdenum (Mo), Manganese (Mn), Nickel (Ni),Niobium (Nb), Silicon (Si), Chromium (Cr),Cobalt (Co),Copper (Cu),Germanium (Ge) ,Gold (Au),Hafnium(Hf),Silver (Ag),Iron (Fe),Tin (Sn), Titanium (Ti),Tatalum (Ta), Tellurium (Te),Tung (W), Zinc (Zn), Zirconium (Zr), Scandium (Sc),Lanthanum (La),Terbium (Tb),Lutetium (Lu),Dysprosium (Dy),Erbium (Er),Neodymium (Nd),Ytterbium (Yb),Europium (Eu),Yttrium (Y),Gadolinium (Gd),Thulium (Tm),Praseodymium (Pr) 1.2 Oxide Evaporation Materials Aluminum Oxide (Al2O3),Neodymium Oxide (Nd2O3),Antimony Oxide (Sb2O3),Niobium Pentoxide (Nb2O5),Antimony Tin Oxide (ATO),Praseodymium Oxide (Pr6O11),Barium Titanate (BaTiO3),Praseodymium Titanate (Pr(TiO2)2),Bismuth Oxide (Bi2O3),Praseodymium Oxide (Pr2O3),Cerium Oxide (CeO2),Samarium Oxide (Sm2O3),Copper Oxide (CuO),Scandium Oxide (Sc2O3),Chromium Oxide (Cr2O3) ,Silicon Dioxide (SiO2) ,Dysprosium Oxide (Dy2O3),Silicon Monoxide (SiO),Erbium Oxide (Er2O3),Strontium Titanate (SrTiO3),Europium Oxide (Eu2O3),Strontium Zirconate (SrZrO3),Gadolinium Oxide (Gd2O3),Tantalum Pentoxide (Ta2O5),Gallium Oxide (Ga2O3),Terbium Oxide (Tb4O7),Germanium Oxide (GeO2),Tellurium Oxide (TeO2),Hafnium Oxide (HfO2) ,Thorium Oxide (ThO2),Holmium Oxide (Ho2O3),Thulium Oxide (Tm2O3),Indium Oxide (In2O3),Titanium Dioxide (TiO2),Indium Tin Oxide (ITO) ,Titanium Monoxide (TiO),Iron Oxide (Fe2O3),Titanium Pentoxide (Ti3O5),Iron Oxide (Fe3O4),Titanium Trioxide (Ti2O3),Lanthanum Oxide (La2O3),Tin Dioxide (SnO2),Lanthanum Aluminate (LaAlO3),Tin Monoxide (SnO),Lead Titanate (PbTiO3),Tungsten oxide (WO3),Lead Zirconate (PbZrO3),Vanadium Pentoxide (V2O5),Lithium Niobate (LiNbO3),Yttrium Aluminum Oxide (YAG)Y3Al5O12,Lithium Oxide (LiO),Ytterbium Oxide (Yb2O3),Lithium Tantalate (LiTaO3),Yttrium Oxide (Y2O3),Lutetium Iron Oxide (Lu3Fe5O12),Zinc Oxide (ZnO) ,Lutetium Oxide (Lu2O3),Zinc Aluminum Oxide (ZnO:Al),Magnesium Oxide (MgO),Zirconium Oxide (ZrO2) (unstabilized),Manganese Oxide(MnO2),,Zirconium Oxide (ZrO2-5-15wt%CaO),Magnesium Titanate (MgTiO3),Zirconia (Y Stab),Molybdenum Oxide (MoO3). 1. 3 Fluoride Evaporation Materials Aluminium Fluoride (AlF3),Praseodymium Fluoride (PrF3),Barium Fluoride (BaF3) ,Magnesium Fluoride (MgF2),Cadmium Fluoride (CdF2),Neodymium Fluoride (NdF3) ,Calcium Fluoride (CaF2) ,Rare Earth Fluoride (ReF3),Cerium Fluoride (CeF3) ,Samarium Fluoride (SmF3) ,Dysprosium Fluoride (DyF3) ,Sodium Fluoride (NaF) ,Erbium Fluoride (ErF3) ,Sodium Aluminum Fluoride (Cryolite) Na3AlF6,Hafnium Fluoride (HfF4),Strontium Fluoride (SrF2) ,Kalium Fluoride (KF) ,Thorium Fluoride (ThF4),Lanthanum Fluoride (LaF3) ,Yttrium Fluoride (YF3) ,Lead Fluoride (PbF2),Ytterbium Fluoride (YbF3) ,Lithium Fluoride (LiF) 1. 4. Other Evaporation Material Aluminum Nitride (AlN), Magnesium Titanate(MgTiO3),Barium Ferrite (BaFeO3),Niobium Nitride (NbN),Barium Titanate (BaTiO3),Indium Antimonide (InSb),Bismuth Titanate(BiTiO3),Praseodymium Titanate (PrTiO3),Boron Nitride (BN) ,Silicon Nitride (Si3N4), Cadmium Sulphide ( CdS),Silicon Carbide (SiC),Cadmium Telluride (CdTe),Strontium Titanate (SrTiO3),Chrome Plated Tungsten Rod ,Tantalum Nitride (TaN),Cryolite (Na3AlF6),Tantalum Carbide (TaC),Gallium Arsenide (GaAs),Titanium Boride (TiB2),Hafnium Nitride (HfN),Titanium Carbide (TiC),Iron Boride (FeB),Titanium Nitride (TiN),Lanthanum Aluminate(LaAlO3),Lead Telluride (PbTe),Tungsten Carbide (WC),Lanthanum Boride (LaB6),Yttrium Ferrite(YFe2O3) ,Lithium Tantalate(LiTaO3),,YBC, Lanthanum Titanate (LaTiO3),Zinc Selenide (ZnSe),Lithium Niobate (LiNbO3),Zinc Telluride (ZnTe),Lead Sulfide (PbS),Zinc Sulphide (ZnS) 1.5 Mixture Evaporation Material Aluminium Oxide +Magnesium Oxide (Al2O3+MgO 1:1) Aluminium Oxide +Zirconium Oxide (Al2O3 +ZrO2 6:4) Antimony Oxide +Tin Dioxide (Sb2O3+SnO2 9:1) (ATO) Antimony Oxide +Zinc Oxide (ZnO+Al2O3) (AZO) Calcium Fluoride + Cerium Fluoride(CaF2 +CeF3 1:1) Indium Oxide+Tin Oxide (In2O3+SnO2 90:10 95:5 65:35) (ITO) Neodymium Pentoxide + Titanium Dioxide (TiO2+ Nb2O5 7:3) Tantalum Pentoxide + Titanium Dioxide (Ta2O5+ TiO2 1:1) Tantalum Pentoxide +Zirconium Oxide (Ta2O5+ ZrO2 3:7) Titanium Dioxide +Zirconium oxide (TiO2+ ZrO2 1:1) Yttrium Oxide +Zirconium Oxide (Y2O3+ ZrO2 1:4) 2. Evaporation Process Assistant Tools Evaporation Crucibles Boron Nitride Crucibles (BN),Copper Crucibles (Cu) ,Graphite Crucibles (C),Gold (Au),Molybdenum Crucibles (Mo),Niobium Crucibles (Nb),Platinum (Pt) ,Silicon Oxide Crucibles (SiO2),Tantalum Crucibles (Ta),Tungsten Crucibles (W),Titanium Boride (TiB2),Aluminum Oxide Crucibles (Al2O3),Zirconium Boride (ZrB2),Zirconium oxide Crucibles (ZrO2) Evaporation Boats Tantalum Boats (Ta),Aluminum Oxide Boats (Al2O3),Platinum Boats (Pt) ,Molybdenum Boats (Mo),Tungsten Boats (W),Titanium Boride (TiB2) Other Evaporation Resource Tungsten Filament (W),Molybdenum Sheet Vacuum or plastic bottle
Hengxing 0.1mm 0.12mm Brass Coated Solar Wafer Cutting Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources. http://en.hengxingchinese.com/ Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsahttp://en.hengxingchinese.com/
Solar Wafer Cutting wire Silicon Cutting Sawing Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity
Solar Wafer Cutting wire Silicon Cutting Sawing Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.
Solar Wafer Cutting wire Silicon Cutting Sawing Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources.