1.The vacuum pen to suck away BGA, convenience, credibility,enduring;
2. The mold piece turns a design, take,maintain all very convenient.
3. The function is strong, automatically Welding and automatically take bga , the optics sticks to pack.
4. The computer control, the intelligence high, the whole operation is simple and easy to learn.
5. The system adopts special prism to match with the high accuracy auto-focus CCD in the optical rightness.
6.Three independence heats area, suiting leaded free manufacturing process.
7.The bottom of the enlargement heats area, having to defend a very hot net.
8. 6 zone control, complete imitate the result of the reflow machine.
9.The independence props up organization , can keep PCB from transform.The specially in keeping with notebook pcb.
10.After the heating complete, the adoption fan carries on cooling to the PCB plank, keeping PCB plank from transform.
11.The BGA has voice to hint function after dismantle unload, weld to complete.
