Blind Vias PCB & HDI PCB, use micro blind vias to increase the trace distribution density. Improve radio frequency, electromagnetic wave interference and hear conduction. Apply Blind Vias PCB & HDI PCB to computer server, mobile phone and digital camera products.HUIHE CIRCUITS is China hdi pcb factory, Our blind buried via PCB has passed ISO9001/ISO13485/IATF16949/UL/RoHS/REACH certification.
Are PCB Boards With Blind And Buried Vias Called HDI PCB?
HDI circuit boards are high density interconnect PCB. The high density PCB that are plated with blind holes and then laminated are all HDI boards, which are divided into first-order, second-order, third-order, fourth-order, and fifth-order HDI. Simple buried vias are not necessarily HDI. .
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We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Hankook Smart Flex AH35 FEATURES AND BENEFITS All weather traction Enhanced controllability Fuel efficient drive Excellent durability The Hankook Smart Flex AH35 is a highway terrain all-season tire manufactured for commercial vehicles. The tyre model is made to be mounted on the vehicle's steering axle. Hankook Smart Flex AH35 - Key Features All-Weather Performance: The tire offers reliable traction in dry, wet, and winter conditions, thanks to its wide grooves and 3D sipes, which also prevent hydroplaning. Enhanced Control: The ribbed tread design ensures constant road contact, improving steering response and driving stability. Fuel Efficiency: The optimized 3D siping reduces rolling resistance, leading to lower fuel consumption and CO2 emissions. Durability: Reinforced carcass structure maintains the tire's shape under heavy loads, extending tread life and making it cost-efficient.
Specifications 1.Competitive Price, fast reply for RFQ 2.UL, ISO9001, ISO14001,ROHS Certificated 3.High Quality, 100% E-Testing OR Flying Probe Testing (100% Function Test Service ) 4. Free samples available Place of Origin: Guangdong, China (Mainland) Brand Name: ShenZhen DiHe Model Number: SZDH-Alu pcb-001 Base Material: Aluminum base Copper Thickness: 1oz Board Thickness: 1.6mm Min. Hole Size: 0.2mm Surface Finishing: HAL Lead Free Wrap and twist:: â?¤0.75% Standard:: IPC-A-6012 Service type: printed circuit board manufacturing (One-stop turnkey service) Insulation thickness: 100-150um Break-down voltage: AC 3.5 OR 6.0KV Withstand voltage: DC 3.0 OR 4.0KV Flammability: t1: 0, t2: 0 Glass Transition Temperature: 130 â?? Dielectric Constant 1MHZ: 5.2 Thermal Stress: 288â??>120S Heat Resistance: 0.6-0.8â??/W CTI: >600V Thermal Conductivity: 1.3, 1.6, 2.0, 3.2W/m.k Packaging & Delivery Packaging Details: Anti-static(vacuum) package with high quality carton box Delivery Detail: 5-7days
Number of layers: 10 Surface finish: ENIG Base material: FR4 W/S: 4/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind Vias Advantages Of 10 Layer ENIG Blind Vias PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi facility is environmental-friendly approved by the government . Famous raw materials brand, Kingboard, Shengyi, ITEQ, Taiyo, Guangxin. Highly automated production line with AIO Optical Scanning, Electroplating Automatic Line, High-speed flying probe test machines and inkjet printer.
What is HDI PCB High density interconnect (HDI) PCB, represent one of the fastest growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design is able to incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter. By using HDI technology, designers now have the ability to place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allow designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays. HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices. Advantages of HDI PCB The most common reason for using HDI technology is a significant increase in packaging density. The space that obtained by finer track structures is available for components. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers. Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
General specification for hdi pcb Layer count: 4-20layers Type of stack up: 1+n+1, 2+n+2 Material available: fr4, high tg fr4, halogen free fr4 Board thickness: 0.4-3.2mm Finished copper thickness: 1/3oz ¡§c 3oz Min trace width/spacing: 3/3mil Min through hole: 0.2mm Min blind via: 0.1mm Surface treatment: immersion gold, enig + osp Vacuum package
Material: fr4 Setup: 3 + 4 + 3 Finishing thickness: 1.0 ¡¨¤0.1mm Minimum width/spacing: 0.10/0.10mm Minimum laser via: 0.1mm Surface finishing: enig + osp Specialty: blind and buried via Application field: communication
Multilayer and 2rd HDI PCB 35
