ZM-R7220A Infrared Soldering Station
ZM R7220A infrared SMD rework station is an intelligent infrared soldering station with real-time temperature monitoring, optical alignment system, rapid heating, and cooling. As an ir soldering station manufacturer, Zhuomao promises to provide high-quality infrared BGA machines. Significantly, Zhuomao's infrared soldering station price is reasonable. Plus, Seamark ZM-R7220A infrared smd rework station is also called zm r6200c in the past.
Functions of R7220A Infrared Soldering Station (ZM R6200)
01
Real-time Temperature Monitoring
Real-time temperature display, with automatic curve analysis function.
02
Optical Alignment System
High-definition CCD (2m pixels) digital imaging, automatic optical zoom system, manual control and laser red-dot alignment.
03
Rapid heating and cooling
The IR preheating zone is heated by a medium wave ceramic infrared heating plate, a multi-functional movable PCB fixing bracket, and a BGA bottom support frame. Laminar integrated cooling fan.
As one of the top infrared soldering station suppliers in China, Seamark ZM is famous for its rich technical force, complete detection means, reliable product quality, and full service. If you want to know the BGA repair machine and to get a perfect infrared soldering station price for your factory, please contact Seamark ZM first.
Specification Of R7220A IR Infrared BGA Rework Station (ZM R6200C)
Power Supply AC220V±10% 50/60HZ
Power 5.65KW(Max), Top heater(1.45KW) Bottom heater (1.2KW), IR Preheater (2.7KW),Other(0.3KW)
PCB Size 412*370mm(Max);6*6mm(Min)
BGA Chip Size 60*60mm(Max);2*2mm(Min)
IR Heater Size 285*375mm
Temperature Sensor 1 pcs
Operation Method 7" HD touchscreen
Control System Autonomous heating control system V2ï¼?software copyrightï¼?
Display System 15" SD industrial display (720P front screen)
Alignment System 2 Million Pixel SD digital imaging system, automatic optical zoom with laser red-dot indicator
Vacuum Adsorption Automatic
Alignment Accuracy ±0.02mm
Temperature Control K-type thermocouple closed-loop control with accuracy up to ±3
Feeding Device No
Positioning V-groove with universal fixture
Dimensions L685*W633*H850mm
Weight 76KG
Difference Between A Hot Air Rework Station And An IR Infrared BGA Rework Station
The main difference between a hot air rework station and an IR BGA Rework China Station is the way they heat the board. A hot air rework station uses heated air to transfer heat from the tool-to-board interface and into the solder balls, whereas an IR BGA Rework Station uses infrared light to heat up just enough of each ball so that it melts.
Uluo5205 soldering station: - color: blue We are main manufacture lead free soldering station and soldering tips. 900m, 200m, 500m, t12, goot, unix, weller series soldering tips, we also customize special soldering tips. Welcome to inquiry! 1set/box. Size:26.5x24x16cm Weight:3.9kg
Power consumption: 90w Temperature range: 180-450 centi-degree Heating element: Imported 1321 ceramic heater
Soldering station Function/feature 1)use double chip operation magnify control the temperature, high precision temperature control. 2) use double chip operation magnify to check malfunction , easy to repair. 3) temperature rises rapidly, it can up to setting temperature soon. 4) use long life heating element and lead-free soldering tip. Specification Input powerú¦ac220v/50hz or 110v/60hz Comsumption power: 95w Voltage output: 24v Ground resistance:
Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power 5100W Max 2 Top heater power 1200W 1st heater¡ 3 Bottom heater power 1200W 2nd heater 4 3rd IR heater 2700W (independent controlling left and right IR heaters) 5 power AC 220V;¨¤10 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions 640¢630900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size Max 410 370mm¡; Min65 65mm 10 Available BGA chip 11- 80 80mm 11 External temperature sensor 1piece 12 Net weight 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power- 5100W Max 2 Top heater power- 1200W ¡ê¡§1st heater 3 Bottom heater power -1200W ¡ê¡§2nd heater 4 3rd IR heater- 2700W (independent controlling left and right IR heaters) 5 power-AC 220V10- 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions- 640,630,900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size- Max 410 mm Min65mm 10 Available BGA chip-180mm 11 External temperature sensor1piece 12 Net weight- 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Main features 1.Embedded industrial control computer,windows system. Adopt high definition human-machine interface, PLC control, there is password protection and modify function, can show 4-6 temperature curves and store multiple sets of data, with instant curves analysis function, and analyzing and correct BGA temperature at any time; 2.For guarantee the heating effect and mounting precision, control independently the top heater and mounting heat ,adopted linear slide make X,Y,Z axis can do micro adjustment and rapid positioning;after mounted, no need to move the PCB board in the bottom area, it can heat directly when move the top heater, avoid the moving of bga placement when move the PCB. Ensured the mounting accuracy and welding effect. 3.top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time, three heaters control independently. Show the heat time, temperature, and curves act, on the touch screen. 4.choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system control temperature precisely through PLC and temperature module, keep the temperature deviation at 2 degree.external temperature measuring interface check temperature precisely, achieve accurate analysis and collate the actual temperature curve. 5.V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board. 6.Flexible and removable universal fixture the operator and the protective effects and no damage to the PCB board suitable for all kinds of sizes of BGA repair. 7.Adopted all kinds of BGA nozzles, with 360,227; rotation, easy for installation and replacement, customized is available; 8.Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image by hand or automatic. 9.The X, Y axis and R angle with micrometer adjust; alignment accuracy is within0.01mm, with high definition HD monitor, avoiding human operation errors completely. 10.There are 8 segments rising temperature and 8 constant temperatures, can store millions of temperature curves, curve analyze, set and modify on the touch screen. 11.With voice control ãalarm in advance .À function, 5-10 seconds before finished soldering and desoldering alarm the operators with voice control to prepare the related works. Powerful cross-flow fan cool the PCB board fast by hand or automatic after desoldering and soldering, it can prevent the PCB board from deformation, ensure the welding effect. 12.With vacuum pump,|¦Ìangle 60 rotation, micrometer precise adjust mounting and nozzle, need no air source. 13.With CE certification, there is emergency stop switch and automatic cut off protective device when abnormal situation happen. Specifications and technical parameters: 1 Total Power-4850W 2 Top heater-800W 3 Bottom heate-The second heat area 1200w, the third heat area 2700w (plus size area to suit any kinds of PCB board) 4 Power-AC220V 50/60Hz 5 Dimensions-L790W640H800 mm 6 Positioning-V-groove, PCB support can X,Y axis adjust at any direction, additional with universal fixture 7 Temperature control-K Sensor, Closed loop 8 Temperature accuracy-2 degree 9 PCB size-Max 370 x 410mm Min 22 x 22mm 10 Work bench fine-tuning-front and back 15mm, right and left 15mm 11 Camera magnification10x-100x times 12 BGA chip2*2-80*80mm 13 Minimum chip spacing-0.15mm 14 External Temperature Sensor1-5 pieces available to choose, optional 15 Placement Accuracy-0.01MM 16 Net weight-93kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Soft soldering tin lead solder wire sn63pb37, with rosin cored flux 1.5--2.2%, diameter 0.35--6.0mm available, packed in spool 1kg, 500g, 1lb..... Or tube 20g, 15g....
Tin lead solder wire sn60pb40 With rosin cored flux 1.8-2.2% Diameter 0.35-6.0mm available Packed in spool 1kg, 500g, 1lb, 250g, 200g.... Or tube 20g, 10g... Melting temperature 183-190â?? Density 8.5 Use pure materials, not recycle, good quality
Tin lead solder wire with rosin cored flux 1.8-2.2% Diameter 0.35-6.0 mm Packed in spool 1kg, 500g, 1lb, 250g, 200g... Or tube 20g, 10g... Melting temperature 183-215 Use pure materials, not recycle, good quality for soldering results.