Hard Gold Finger Pcb

Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au: min. Gold fingers/Au:30u Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.

4-layer printed circuit board with selective hard gold coating 50 micro inch (1.25 micrometers) Pcb p / n: 842378 1. Number of layers: 4 layers 2. Material: fr4 Thickness 3.Board: 1.6mm 4. Copper thickness: 1/1/1/1 ounce of copper 5. The minimum drill size: 0.2 mm 6. Minimum track and clearance: 0.125 mm 7. Surface: submerged gold + selective solid gold 8.Green soldering mask 9.Special technology: selective solid gold coating up to 50u "(1.25um) 10.Applications: consumer electronic products 11.One stopping the turnkey service of ems, including the purchase of materials, smt and through assembly, assembly of prefabricated boxes 12.Ul is recognized and complies with rohs requirements.

4-Layer, Immersion Gold Gold fingers-PCB Multilayer PCB, 4 Layer PCB Board, Multilayer FPC, Immersion Gold PCB, Gold Fingers PCB, OEM PCB Manufacturer Layer/Board thickness: 4L/1.6mm Suface Finish: Immersion Gold Trace/Space: 5/5mil Smallest Hole Diameter: 0.2MM Golder fingers PCBMAIN can produce multilayer hasl PCB including 2 layer flexible PCB, 6,4,8,10,12 layer PCB board, multilayer FPC, immersion gold PCB, gold fingers PCB and other high density multilayer PCB.

Quick Details Place of Origin: Liaoning, China (Mainland) Brand Name: GESP Model Number: 2 Layer Pcb Base Material: FR-4 Copper Thickness: 0.25 Oz -12 Oz Board Thickness: 1.6mm-3.2mm 0.2mm-4.5mm Min. Hole Size: 0.15mm Min. Line Width: 5mil Min. Line Spacing: 4 mil Surface Finishing: HASL/enig/OSP/immersion silver /gold finger Base Material:: FR-4,CEM-3, Roger,teflon , taconic,arlon , Metal/ceramic/aluminum base Copper Thickness:: 0.25 oz -12 oz Board Thickness:: 0.005 Certificate:: ISO/UL/RoHS/TS16949 Gold thickness:: 0.05UM V-cut Scoring:: YES Standards:: IPC Class 2, Class 3 Max. Panel Size:: 22 Impedance Control: yes Surface Finishing:: HASL Lead Free/OSP/Soft Gold/Hard Gold

Teson tech is a professional pcb & pcba factory located in shenzhen china. We offer from 2-18 layers volume production and 2-24 layers prototype. We could offer you many kinds of special high technology of multi-layers circuits such as backplane pcb, metal base pcb, hi-tg heavy copper foil pcb, flat winding pcb, high frequency pcb, mixed dielectric base pcb, flex and flex-rigid pcb. Testing procedures for quality warranty: We perform multiple quality assuring procedures before shipping our products to customers. - 100% visual inspection - metal thickness test - copper thickness test - via hole test - 100% flying probe - 100% e test fixture - impedance control test - solder ability detection - digital metallogenic microscope - 100% aoi (automated optical inspection) Quotation requirement: -gerber file would be the best to get an accurate quotation. If no, following specifications are needed for pcb quotation. 1. Quantity 2. Base material 3. Layer count 4. Board thickness 5. Copper thickness 6. Surface treatment 7. Color of solder mask 8 other special requirements Pcb assembly files requests: 1. Gerber files of the bare pcb 2. Bom (bill of material) for assembly To shorten the lead time, please kindly advise us if there is any acceptable components substitution. 3. Testing guide & test fixtures if necessary 4. Programming files & programming tool if necessary 5. Schematic if necessary Teson tech has being done strongly to meet special needs of customer. We will do our best to give you our professional engineering supports, professional quality control in manufacturing and competitive prices. We hope that we could have a chance to have good and long term business with you! Vacuum package

Key specifications/special features: specifications: Base material: ptfe, pcb, fr4 Layer count: 4layer board Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: enig Solder mask color: green Available specifications: Base materials: fr4, aluminum, fpc and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: hal, enig, osp, gold finger and tin chemistry Possible solder mask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1, 000mm Hole diameter: 0.2mm (minimum) Line width: 0.075mm (minimum) Line spacing: 0.075mm (minimum) Smt pitch: 30¡ã (minimum) Annular ring: 0.05mm (minimum) Aspect ratio: 11:01 Surface/hole plating tolerance: Hole tolerance (pth): 0.25mm Hole tolerance (npth): 0.15mm Sm tolerance (lpi): dimensions

Layer: 1 to 32 layers Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers Board thickness: 0.21mm to 7.0mm Copper thickness: 0.5 OZ to 7.0 OZ Copper thickness in hole: >25.0 um (>1mil) Max. Board Size: 23 ¡¨¢ 25 (580mm¡¨¢900mm) Min. Drilled Hole Size: 3mil (0.075mm) Min. Line Width: 3mil (0.075mm) Min. Line Spacing: 3mil (0.075mm)

Available specifications: Base materials: FR4, aluminum, FPC and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry Possible soldermask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1,000mm Hole diameter: 0.2mm (minimum) Line width: 0.075mm (minimum) Line spacing: 0.075mm (minimum) SMT pitch: 30¡ã (minimum) Annular ring: 0.05mm (minimum) Aspect ratio: 11:01 Surface/hole plating tolerance: Hole tolerance (PTH): 0.25mm Hole tolerance (NPTH): 0.15mm SM tolerance (LPI): Dimension Electrically test: supported RoHS Directive-compliant Possibility of SMT device mounting: supported Product-level Certifications: SGS:12024915-G2 ROHS:SP10-003347-SH UL:E302512-080423 SGS:12409491-GZ

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers