Quick Details Type:High Power LED Chip Material:InGaN Emitting Color:Cool White Luminous Flux(lm):1120 lm Power:19W Viewing Angle(°):120 deg Color Rendering Index(Ra):68 Color Temperature:5700K Place of Origin:United States Brand Name:Cree Certification:CE, RoHS Product:White LEDs Voltage:6V 12 V Current:5.75 V White 1400 mA (6 V) 11.5 V White 700 mA (12 V) CCT:5700KLength:5 mm width:5 mm Max Light Output (lm):2546 lm lumination Color:white Brand:Cree Powered by Cree??s groundbreaking SC5 Technolog Platform, the XLamp XHP50 LED is a member of Cree's Extreme High Power (XHP) class of LEDs that redefines lumen density and reliability to radically reduce system costs by up to 40 percent. At its maximum current, the XHP50 LED delivers twice the light output of the industry??s brightest single-die LED, the XLamp XM-L2 LED, at a similar lumens per watt and without increasing the package footprint. The XHP50 LED also achieves longer lifetime at higher operating temperatures. The overall result is significantly lower thermal, mechanical and optical costs at the system level. FEATURES Available in white, configurable to 6 V or 12 V by PCB layout Available in 5 step EasyWhite bins at 3000 K to 5000 K CCT, 3 step EasyWhite bins at 2700 K to 5000 K and 2-step EasyWhite bins at 2700 K to 4000 K CCT Available in ANSI white bins at 3000 K to 7000 K CCT Available in standard, 70, 80, and 90 minimum CRI options Binned at 85 °C Maximum drive current: 3000 mA (6 V), 1500 mA (12 V) Low thermal resistance: 1.2 °C/W Wide viewing angle: 120° Unlimited floor life at 30 ºC/85% RH Reflow solderable JEDEC J STD 020C RoHS and REACh compliant UL recognized component (E349212) Specification: Size: 5 x 5 mm Product Options: 6 V 12 V High CRI Maximum Drive Current (Standard) :3 A (6 V)/1.5 A (12 V) Max Power :(W) 19 W Max Light Output (lm) :2546 lm Maximum Efficacy at Binning Conditions (lm/W):149 lm/W Typical Forward Voltage: 5.75 V White 1400 mA (6 V) / 11.5 V White 700 mA (12 V) Maximum Reverse Voltage: Under 5 V Viewing Angle: 120 ° Maximum Junction Temperature:150 °C Binning: 85°C ANSI (White) 2- 3- and 5-Step EasyWhite Maximum ESD Withstand Voltage: 8000 V (HBM per Mil-Std-883D) Reflow Solderable: Yes JEDEC J STD 020C compatible RoHS Compliant: Yes REACh Compliant: Yes UL Recognized:Yes Level 4 Enclosure Consideration