Descriptions:
Fiberglass thermal conductive tape is made of glass fabric, double sided coated advanced thermal conductive pressure sensitive adhesive.Xinst-P80XXC series provides a better way for applications requiring good adhesion strength and superior thermal conductive efficiency. Xinst-P series is suitable to apply to electronic mechanical components assembly such as the heat sink module and LED light bar module to provide a better heat-transfer path between heat-generating components and heat sink or other cooling devices

Features:
Complete thickness standard is available.
Various structures are for different applications.
Stable and economic.
Superior adhesion strength and thermal conductive efficiency.

Applications:
Assembly of the heat sink and DDR-RAM module.
Assembly of the LED light bar module and metal frame bezel.
Die-cut piece and Laminate.
Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding.