Descriptions: Thermal conductive glue is made of an advanced thermal conductive pressure sensitive adhesive.Xinst-P80XXN series provides a better way for applications requiring good adhesion strength and superior thermal conductive efficiency. Xinst-P80XXN series is suitable to apply to electronic mechanical components assembly such as the heat sink module and LED light bar module to provide a better heat-transfer path between heat-generating components and heat sink or other cooling devices. Features: Complete thickness standard is available. Various structures are for different applications. Stable and economic. Superior adhesion strength and thermal conductive efficiency. Applications: Assembly of the heat sink and DDR-RAM module. Assembly of the LED light bar module and metal frame bezel. Die-cut piece and Laminate. Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding.