Double Conductive Tin Plated Copper Foil Tape For EMI Shielding

Descriptions:
Tin Plated Copper Foil Tape consists of an embossed deadsoft tin-plated copper foil backing and an aggressive pressure-sensitve acrylic adhesive. The edgs of the embossed pattern pressed into the foil cut through the adhesive layer to establish reliable metal-to-metal contact between the backing and the application substrate.

Features:
Good electrical conductivity from the base material through the surface of viscose to foil substrate.
With good shielding effect.

Applications:
Used for high-end electronic equipment, components of the grounding and EMI shielding, the tin on the plating layer has good weld-ability, and high oxidation and corrosion resistance.